Patents by Inventor Chong Poh Lim

Chong Poh Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stacked leadframe packages
    Patent number: 9601419
    Abstract: A multi-package unit having stacked packages is provided. A multi-package unit may include a first package and a second package mounted on the first package. The first package may be a leadframe package that includes metal leads extending beyond the perimeter of the first package. The first package may include a first integrated circuit die assembled within the first package using the wirebond configuration or the flip-chip configuration. The second package may be a leadframe package or a leadless package that includes a second integrated circuit die. The second package may be smaller than the first package. The first and second integrated circuit dies may be formed using different integrated circuit fabrication technologies.
    Type: Grant
    Filed: June 6, 2014
    Date of Patent: March 21, 2017
    Assignee: Altera Corporation
    Inventors: Teik Tiong Toong, Chong Poh Lim