Patents by Inventor Chong S. Tan

Chong S. Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11942723
    Abstract: Examples described herein relate to connector assembly for a connecting device. The connector assembly may include an electrical connector connectible with a corresponding receiving structure on a receiving device separate from the connecting device. Further, the connector assembly may include a connector housing enclosing the electrical connector. The connector housing may include a mounting lever engaged with a body of the connecting device to secure the connector housing with the connecting device and allow the connector housing to move relative to the body of the connecting device. Further, the connector assembly may include a biasing member disposed within the connector housing to bias the electrical connector toward the receiving structure on the receiving device.
    Type: Grant
    Filed: April 6, 2022
    Date of Patent: March 26, 2024
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Chong S. Tan, Joseph Allen
  • Patent number: 11452237
    Abstract: Example implementations relate to a liquid cooling interconnect module of a computing system, and a tool-less method of assembling the liquid cooling interconnect module having a housing, a biasing member, and an interconnect block. The housing has an interlocking member, a support assembly, and a bore extending between a first end and a second end of the housing. The biasing member is disposed within the bore such that it contacts the support assembly. The interconnect block having a pair of through openings, is configured to be slidably inserted within the bore such that it contacts the biasing member. Further, the interconnect block is configured to compress the biasing member against the support assembly to a compressed position when the interconnect block is inserted into the bore, and the interlocking member is configured to retain the interconnect block within the housing when the biasing member is in the compressed position.
    Type: Grant
    Filed: October 16, 2020
    Date of Patent: September 20, 2022
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Chong S. Tan, Joseph Allen, Kai Zhang
  • Publication number: 20220231454
    Abstract: Examples described herein relate to connector assembly for a connecting device. The connector assembly may include an electrical connector connectible with a corresponding receiving structure on a receiving device separate from the connecting device. Further, the connector assembly may include a connector housing enclosing the electrical connector. The connector housing may include a mounting lever engaged with a body of the connecting device to secure the connector housing with the connecting device and allow the connector housing to move relative to the body of the connecting device. Further, the connector assembly may include a biasing member disposed within the connector housing to bias the electrical connector toward the receiving structure on the receiving device.
    Type: Application
    Filed: April 6, 2022
    Publication date: July 21, 2022
    Inventors: Chong S. Tan, Joseph Allen
  • Patent number: 11322886
    Abstract: Examples described herein relate to connector assembly for a connecting device. The connector assembly may include an electrical connector connectible with a corresponding receiving structure on a receiving device separate from the connecting device. Further, the connector assembly may include a connector housing enclosing the electrical connector. The connector housing may include a mounting lever engaged with a body of the connecting device to secure the connector housing with the connecting device and allow the connector housing to move relative to the body of the connecting device. Further, the connector assembly may include a biasing member disposed within the connector housing to bias the electrical connector toward the receiving structure on the receiving device.
    Type: Grant
    Filed: July 23, 2020
    Date of Patent: May 3, 2022
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Chong S. Tan, Joseph Allen
  • Publication number: 20220124942
    Abstract: Example implementations relate to a liquid cooling interconnect module of a computing system, and a tool-less method of assembling the liquid cooling interconnect module having a housing, a biasing member, and an interconnect block. The housing has an interlocking member, a support assembly, and a bore extending between a first end and a second end of the housing. The biasing member is disposed within the bore such that it contacts the support assembly. The interconnect block having a pair of through openings, is configured to be slidably inserted within the bore such that it contacts the biasing member. Further, the interconnect block is configured to compress the biasing member against the support assembly to a compressed position when the interconnect block is inserted into the bore, and the interlocking member is configured to retain the interconnect block within the housing when the biasing member is in the compressed position.
    Type: Application
    Filed: October 16, 2020
    Publication date: April 21, 2022
    Inventors: Chong S. Tan, Joseph Allen, Kai Zhang
  • Publication number: 20220029352
    Abstract: Examples described herein relate to connector assembly for a connecting device. The connector assembly may include an electrical connector connectible with a corresponding receiving structure on a receiving device separate from the connecting device. Further, the connector assembly may include a connector housing enclosing the electrical connector. The connector housing may include a mounting lever engaged with a body of the connecting device to secure the connector housing with the connecting device and allow the connector housing to move relative to the body of the connecting device. Further, the connector assembly may include a biasing member disposed within the connector housing to bias the electrical connector toward the receiving structure on the receiving device.
    Type: Application
    Filed: July 23, 2020
    Publication date: January 27, 2022
    Inventors: Chong S. Tan, Joseph Allen
  • Publication number: 20210404216
    Abstract: Example implementations relate to a security system having an electronic lock including latch and security modules, to control access to electronic devices. The latch module includes a receiver, a handle, and a torque member rotatably coupled to the receiver and handle. The receiver includes a first recess, a second recess, and a lobe to releasably engage the electronic device within the first recess. The security module includes a tension spring, an actuator, and a lock member having a first pin and a second pin. The tension spring is coupled to the lock member to engage the first pin to second recess when the latch module is in a latched configuration, and hold the security module in a lock-in position. The actuator is releasably engaged to the second pin for rotating the lock member to disengage the first pin from second recess, and release the security module from the lock-in position.
    Type: Application
    Filed: June 26, 2020
    Publication date: December 30, 2021
    Inventors: Chong S. Tan, Joseph Allen, John Norton
  • Patent number: 9192070
    Abstract: A method and apparatus for loading IC's into a socket lid is disclosed. The IC is first loaded into a lid. Once the IC has been loaded into the lid, the lid is rotated into a closed position on the frame. The lid is then locked in place on the frame by rotating at least one locking lever into a closed lacked position, where the locking lever forces the lid down against the socket contacts against a spring.
    Type: Grant
    Filed: February 28, 2011
    Date of Patent: November 17, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chong S Tan, Robert J Hastings, Joseph R Allen, Michael T. Gill, Kelly K Smith, Keith A Sauer
  • Publication number: 20130322037
    Abstract: A method and apparatus for loading IC's into a socket lid is disclosed. The IC is first loaded into a lid. Once the IC has been loaded into the lid, the lid is rotated into a closed position on the frame. The lid is then locked in place on the frame by rotating at least one locking lever into a closed lacked position, where the locking lever forces the lid down against the socket contacts against a spring.
    Type: Application
    Filed: February 28, 2011
    Publication date: December 5, 2013
    Inventors: Chong S. Tan, Robert J., Hastings, Joseph R. Allen, Michael T. Gill, Kelly K. Smith, Keith A. Sauer