Patents by Inventor Chong S. Tan
Chong S. Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11942723Abstract: Examples described herein relate to connector assembly for a connecting device. The connector assembly may include an electrical connector connectible with a corresponding receiving structure on a receiving device separate from the connecting device. Further, the connector assembly may include a connector housing enclosing the electrical connector. The connector housing may include a mounting lever engaged with a body of the connecting device to secure the connector housing with the connecting device and allow the connector housing to move relative to the body of the connecting device. Further, the connector assembly may include a biasing member disposed within the connector housing to bias the electrical connector toward the receiving structure on the receiving device.Type: GrantFiled: April 6, 2022Date of Patent: March 26, 2024Assignee: Hewlett Packard Enterprise Development LPInventors: Chong S. Tan, Joseph Allen
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Patent number: 11452237Abstract: Example implementations relate to a liquid cooling interconnect module of a computing system, and a tool-less method of assembling the liquid cooling interconnect module having a housing, a biasing member, and an interconnect block. The housing has an interlocking member, a support assembly, and a bore extending between a first end and a second end of the housing. The biasing member is disposed within the bore such that it contacts the support assembly. The interconnect block having a pair of through openings, is configured to be slidably inserted within the bore such that it contacts the biasing member. Further, the interconnect block is configured to compress the biasing member against the support assembly to a compressed position when the interconnect block is inserted into the bore, and the interlocking member is configured to retain the interconnect block within the housing when the biasing member is in the compressed position.Type: GrantFiled: October 16, 2020Date of Patent: September 20, 2022Assignee: Hewlett Packard Enterprise Development LPInventors: Chong S. Tan, Joseph Allen, Kai Zhang
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Publication number: 20220231454Abstract: Examples described herein relate to connector assembly for a connecting device. The connector assembly may include an electrical connector connectible with a corresponding receiving structure on a receiving device separate from the connecting device. Further, the connector assembly may include a connector housing enclosing the electrical connector. The connector housing may include a mounting lever engaged with a body of the connecting device to secure the connector housing with the connecting device and allow the connector housing to move relative to the body of the connecting device. Further, the connector assembly may include a biasing member disposed within the connector housing to bias the electrical connector toward the receiving structure on the receiving device.Type: ApplicationFiled: April 6, 2022Publication date: July 21, 2022Inventors: Chong S. Tan, Joseph Allen
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Patent number: 11322886Abstract: Examples described herein relate to connector assembly for a connecting device. The connector assembly may include an electrical connector connectible with a corresponding receiving structure on a receiving device separate from the connecting device. Further, the connector assembly may include a connector housing enclosing the electrical connector. The connector housing may include a mounting lever engaged with a body of the connecting device to secure the connector housing with the connecting device and allow the connector housing to move relative to the body of the connecting device. Further, the connector assembly may include a biasing member disposed within the connector housing to bias the electrical connector toward the receiving structure on the receiving device.Type: GrantFiled: July 23, 2020Date of Patent: May 3, 2022Assignee: Hewlett Packard Enterprise Development LPInventors: Chong S. Tan, Joseph Allen
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Publication number: 20220124942Abstract: Example implementations relate to a liquid cooling interconnect module of a computing system, and a tool-less method of assembling the liquid cooling interconnect module having a housing, a biasing member, and an interconnect block. The housing has an interlocking member, a support assembly, and a bore extending between a first end and a second end of the housing. The biasing member is disposed within the bore such that it contacts the support assembly. The interconnect block having a pair of through openings, is configured to be slidably inserted within the bore such that it contacts the biasing member. Further, the interconnect block is configured to compress the biasing member against the support assembly to a compressed position when the interconnect block is inserted into the bore, and the interlocking member is configured to retain the interconnect block within the housing when the biasing member is in the compressed position.Type: ApplicationFiled: October 16, 2020Publication date: April 21, 2022Inventors: Chong S. Tan, Joseph Allen, Kai Zhang
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Publication number: 20220029352Abstract: Examples described herein relate to connector assembly for a connecting device. The connector assembly may include an electrical connector connectible with a corresponding receiving structure on a receiving device separate from the connecting device. Further, the connector assembly may include a connector housing enclosing the electrical connector. The connector housing may include a mounting lever engaged with a body of the connecting device to secure the connector housing with the connecting device and allow the connector housing to move relative to the body of the connecting device. Further, the connector assembly may include a biasing member disposed within the connector housing to bias the electrical connector toward the receiving structure on the receiving device.Type: ApplicationFiled: July 23, 2020Publication date: January 27, 2022Inventors: Chong S. Tan, Joseph Allen
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Publication number: 20210404216Abstract: Example implementations relate to a security system having an electronic lock including latch and security modules, to control access to electronic devices. The latch module includes a receiver, a handle, and a torque member rotatably coupled to the receiver and handle. The receiver includes a first recess, a second recess, and a lobe to releasably engage the electronic device within the first recess. The security module includes a tension spring, an actuator, and a lock member having a first pin and a second pin. The tension spring is coupled to the lock member to engage the first pin to second recess when the latch module is in a latched configuration, and hold the security module in a lock-in position. The actuator is releasably engaged to the second pin for rotating the lock member to disengage the first pin from second recess, and release the security module from the lock-in position.Type: ApplicationFiled: June 26, 2020Publication date: December 30, 2021Inventors: Chong S. Tan, Joseph Allen, John Norton
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Patent number: 9192070Abstract: A method and apparatus for loading IC's into a socket lid is disclosed. The IC is first loaded into a lid. Once the IC has been loaded into the lid, the lid is rotated into a closed position on the frame. The lid is then locked in place on the frame by rotating at least one locking lever into a closed lacked position, where the locking lever forces the lid down against the socket contacts against a spring.Type: GrantFiled: February 28, 2011Date of Patent: November 17, 2015Assignee: Hewlett-Packard Development Company, L.P.Inventors: Chong S Tan, Robert J Hastings, Joseph R Allen, Michael T. Gill, Kelly K Smith, Keith A Sauer
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Publication number: 20130322037Abstract: A method and apparatus for loading IC's into a socket lid is disclosed. The IC is first loaded into a lid. Once the IC has been loaded into the lid, the lid is rotated into a closed position on the frame. The lid is then locked in place on the frame by rotating at least one locking lever into a closed lacked position, where the locking lever forces the lid down against the socket contacts against a spring.Type: ApplicationFiled: February 28, 2011Publication date: December 5, 2013Inventors: Chong S. Tan, Robert J., Hastings, Joseph R. Allen, Michael T. Gill, Kelly K. Smith, Keith A. Sauer