Patents by Inventor Chong-Yong J. Kim

Chong-Yong J. Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6786810
    Abstract: A process for planarizing, polishing, or providing other modification of a wafer surface or other workpiece. The process includes using an abrasive article having a textured abrasive coating affixed to a backing. The abrasive article includes a monitoring element, such as a window, to allow transmission of radiation therethrough. The radiation level is monitored throughout the planarization process to determine the approach of the desired endpoint. The window in the abrasive coating can be an area devoid of abrasive coating or having minimal or a thinned abrasive coating.
    Type: Grant
    Filed: September 24, 2002
    Date of Patent: September 7, 2004
    Assignee: 3M Innovative Properties Company
    Inventors: Michael J. Muilenburg, Chong-Yong J. Kim, Jerry J. Fizel, Richard J. Webb, John J. Gagliardi, Daniel B. Pendergrass, Jr., Robert J. Streifel, Wesley J. Bruxvoort
  • Patent number: 6604985
    Abstract: A process for planarizing, polishing, or providing other modification of a wafer surface or other workpiece. The process includes using an abrasive article having a textured abrasive coating affixed to a backing. The abrasive article includes a monitoring element, such as a window, to allow transmission of radiation therethrough. The radiation level is monitored throughout the planarization process to determine the approach of the desired endpoint. The window in the abrasive coating can be an area devoid of abrasive coating or having minimal or a thinned abrasive coating.
    Type: Grant
    Filed: November 7, 2002
    Date of Patent: August 12, 2003
    Assignee: 3M Innovative Properties Company
    Inventors: Michael J. Muilenburg, Chong-Yong J. Kim, Jerry J. Fizel, Richard J. Webb, John J. Gagliardi, Daniel B. Pendergrass, Jr., Robert J. Streifel, Wesley J. Bruxvoort
  • Publication number: 20030064663
    Abstract: A process for planarizing, polishing, or providing other modification of a wafer surface or other workpiece. The process includes using an abrasive article having a textured abrasive coating affixed to a backing. The abrasive article includes a monitoring element, such as a window, to allow transmission of radiation therethrough. The radiation level is monitored throughout the planarization process to determine the approach of the desired endpoint. The window in the abrasive coating can be an area devoid of abrasive coating or having minimal or a thinned abrasive coating.
    Type: Application
    Filed: November 7, 2002
    Publication date: April 3, 2003
    Applicant: 3M Innovative Properties Company
    Inventors: Michael J. Muilenburg, Chong-Yong J. Kim, Jerry L. Fizel, Richard J. Webb, John J. Gagliardi, Daniel B. Pendergrass, Robert J. Streifel, Wesley J. Bruxvoort
  • Publication number: 20030022598
    Abstract: A process for planarizing, polishing, or providing other modification of a wafer surface or other workpiece. The process includes using an abrasive article having a textured abrasive coating affixed to a backing. The abrasive article includes a monitoring element, such as a window, to allow transmission of radiation therethrough. The radiation level is monitored throughout the planarization process to determine the approach of the desired endpoint. The window in the abrasive coating can be an area devoid of abrasive coating or having minimal or a thinned abrasive coating.
    Type: Application
    Filed: September 24, 2002
    Publication date: January 30, 2003
    Applicant: 3M Innovative Properties Company
    Inventors: Michael J. Muilenburg, Chong-Yong J. Kim, Jerry J. Fizel, Richard J. Webb, John J. Gagliardi, Daniel B. Pendergrass, Robert J. Streifel, Wesley J. Bruxvoort
  • Publication number: 20020072296
    Abstract: A process for planarizing, polishing, or providing other modification of a wafer surface or other workpiece. The process includes using an abrasive article having a textured abrasive coating affixed to a backing. The abrasive article includes a monitoring element, such as a window, to allow transmission of radiation therethrough. The radiation level is monitored throughout the planarization process to determine the approach of the desired endpoint. The window in the abrasive coating can be an area devoid of abrasive coating or having minimal or a thinned abrasive coating.
    Type: Application
    Filed: November 29, 2000
    Publication date: June 13, 2002
    Inventors: Michael J. Muilenburg, Chong-Yong J. Kim, Jerry J. Fizel, Richard J. Webb, John J. Gagliardi, Daniel B. Pendergrass, Robert J. Streifel, Wesley J. Bruxvoort