Patents by Inventor Chong Yoon

Chong Yoon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230390362
    Abstract: Provided is use of a trigonal agonist having activities to all of glucagon, GLP-1, and GIP receptors, and/or a conjugate thereof in the prevention or treatment of sequelae following respiratory infectious diseases.
    Type: Application
    Filed: October 18, 2021
    Publication date: December 7, 2023
    Applicant: HANMI PHARM. CO., LTD.
    Inventors: Jong Suk LEE, Jung Kuk LEE, Seon Myeong LEE, Sang Hyun LEE, Jeong A KIM, Euh Lim OH, Chong Yoon LIM
  • Publication number: 20230118307
    Abstract: New uses of a triple agonist are disclosed. A triple agonist having activities to all of glucagon, GLP-1, and GIP receptors, or conjugates thereof exhibits an activity of preventing and/or treating lung diseases. A use of the triple agonist or a conjugate thereof as a preventive and/or therapeutic agent for lung disease, and compositions and methods for preventing and/or treating lung cancer employing the triple agonist having activities to all of glucagon, GLP-1, and GIP receptors, and/or conjugates are disclosed.
    Type: Application
    Filed: November 20, 2020
    Publication date: April 20, 2023
    Applicant: HANMI PHARM. CO., LTD.
    Inventors: Seon Myeong LEE, Jong Suk LEE, Jung Kuk KIM, Sang Hyun LEE, Euh Lim OH, Hyo Sang JO, Eun Jin PARK, Chong Yoon LIM
  • Publication number: 20220395011
    Abstract: The invention refers to a probiotic food supplement comprising a blend of strains of lactobacilli and bifidobacteria synergistically interacting with food (for instance milk) assuring thereby an improved beneficial effect on human health, with special reference to 0-6 months babies, weaning babies, breastfed and formula fed infants as well as lactating mothers. Synergistic blends, which may also be defined as synteractive, have been designed to maximise their probiotic action when assumed with milk and/or food, in whatever state or formulation.
    Type: Application
    Filed: November 11, 2020
    Publication date: December 15, 2022
    Inventors: Marina ELLI, Chong-Yoon LIM
  • Publication number: 20220211082
    Abstract: A fermented food product or food supplement comprising a vegetable substrate fermented by a probiotic blend is disclosed. The fermented food product or food supplement according to the invention is useful in particular for improving natural maternity, lactation and baby weaning. The invention also discloses a process for the preparation of the fermented food product or food supplement comprising the fermentation of a vegetal substrate with the probiotic blend.
    Type: Application
    Filed: March 31, 2020
    Publication date: July 7, 2022
    Inventors: Marina ELLI, Chong-Yoon LIM
  • Patent number: 10474480
    Abstract: Methods and an electronic device are provided for displaying one or more items. An aspect ratio of each of the items is determined. A full screen is divided into regions. Each of the regions has an aspect ratio that is the same as that of a respective one of the items. The items are simultaneously displayed in the regions.
    Type: Grant
    Filed: January 7, 2016
    Date of Patent: November 12, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Suk-Jae Lee, Yong-Chae Jung, A-Reum Kim, Jung-Won Lee, Chong-Yoon Chung
  • Publication number: 20160196806
    Abstract: Methods and an electronic device are provided for displaying one or more items. An aspect ratio of each of the items is determined. A full screen is divided into regions. Each of the regions has an aspect ratio that is the same as that of a respective one of the items. The items are simultaneously displayed in the regions.
    Type: Application
    Filed: January 7, 2016
    Publication date: July 7, 2016
    Inventors: Suk-Jae Lee, Yong-chae Jung, A-Reum Kim, Jung-Won Lee, Chong-Yoon Chung
  • Patent number: 8335084
    Abstract: Disclosed are any electronic system or module which includes embedded actives and discrete passives, and methods for use in fabricating packages containing embedded active devices and/or discrete passive devices. Exemplary apparatus comprises a plurality of build-up layers defining circuit interconnections and that comprise one or more thin film type of embedded passive devices, at least a cavity formed in the build-up layers, and at least an active device and/or at least a discrete passive device disposed in the cavity and electrically connected to the circuit interconnections of the build-up layers. A stiffener may be coupled to an exposed (back) surface of the active device and to an adjacent surface of the build-up layers. The build-up layers may be mounted to a core, and the core may be attached to a printed circuit board. Alternatively, a bottom surface of the build-up layers may be mounted to a printed circuit board without core.
    Type: Grant
    Filed: July 27, 2006
    Date of Patent: December 18, 2012
    Assignee: Georgia Tech Research Corporation
    Inventors: Baik-Woo Lee, Chong Yoon, Verkatesh Sundaram, Rao Tummala
  • Publication number: 20070025092
    Abstract: Disclosed are any electronic system or module which includes embedded actives and discrete passives, and methods for use in fabricating packages containing embedded active devices and/or discrete passive devices. Exemplary apparatus comprises a plurality of build-up layers defining circuit interconnections and that comprise one or more thin film type of embedded passive devices, at least a cavity formed in the build-up layers, and at least an active device and/or at least a discrete passive device disposed in the cavity and electrically connected to the circuit interconnections of the build-up layers. A stiffener may be coupled to an exposed (back) surface of the active device and to an adjacent surface of the build-up layers. The build-up layers may be mounted to a core, and the core may be attached to a printed circuit board. Alternatively, a bottom surface of the build-up layers may be mounted to a printed circuit board without core.
    Type: Application
    Filed: July 27, 2006
    Publication date: February 1, 2007
    Inventors: Baik-Woo Lee, Chong Yoon, Verkatesh Sundaram, Rao Tummala
  • Publication number: 20060258327
    Abstract: Disclosed are composite RF devices having low temperature coefficient of permittivity (TCP) and methods for fabricating same. The RF devices comprise first and second conductive electrodes with a composite dielectric material disposed there between that comprises a polymer material having positive or negative TCP and one or more ceramic filler materials having corresponding negative or positive temperature coefficients of permittivity. The composite dielectric material may also comprise a blend of positive and negative TCP ceramic filler materials. The composite dielectric material may also have a bimodal distribution of positive and negative TCP filler materials to vary the packing density of the dielectric material. Various devices may be fabricated including thin and thick film capacitors and antennas, which may be formed on or within an organic layer, silicon material, ceramic material, ceramic composite material or insulating material.
    Type: Application
    Filed: May 8, 2006
    Publication date: November 16, 2006
    Inventors: Baik-Woo Lee, Markondeya Pulugurtha, Chong Yoon, Rao Tummala, Isaac Abothu, Swapan Bhattacharya
  • Patent number: D486810
    Type: Grant
    Filed: April 14, 2003
    Date of Patent: February 17, 2004
    Assignee: LG Electronics Inc.
    Inventor: Chong Yoon Chung
  • Patent number: D488452
    Type: Grant
    Filed: March 19, 2003
    Date of Patent: April 13, 2004
    Assignee: LG Electronics Inc.
    Inventor: Chong Yoon Chung
  • Patent number: D859388
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: September 10, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chong-Yoon Chung, Ji-Su Hwang, Hae-Sung Park, Hyoung-Shin Park, Yun-Jin Kim
  • Patent number: D928768
    Type: Grant
    Filed: March 24, 2020
    Date of Patent: August 24, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chong-Yoon Chung, Bum-Soo Park, Hyun-Keun Son
  • Patent number: D929383
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: August 31, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ji Su Hwang, Chong Yoon Chung, Min Ah Koh
  • Patent number: D929384
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: August 31, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyoung Shin Park, Chong-Yoon Chung, Min Ah Koh
  • Patent number: D929979
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: September 7, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ji Su Hwang, Min Ah Koh, Chong Yoon Chung
  • Patent number: D982543
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: April 4, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chong-Yoon Chung, Sang-Sik Park