Patents by Inventor Chonghao WANG

Chonghao WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hybrid organosilicon thermoplastic elastomer and preparation method therefor
    Patent number: 9593198
    Abstract: The present invention discloses a hybrid organic silicon thermoplastic elastomer and a preparation method thereof. The copolymer, namely the elastomer, has a structural formula as shown in formula I. In the preparation method, the preparation proceeds in a solution or main body polymerization system through organopolysiloxane with two functionalized ends, a compound with a structural formula of OCN—Y—NCO, a branched compound with a structural formula of and a compound with a structural formula of NH2—Z—NH2, which can be added or not. The softening temperature of the copolymer is in a range of 40° C.˜190° C., and the present invention has high processing mobility.
    Type: Grant
    Filed: December 26, 2014
    Date of Patent: March 14, 2017
    Assignee: CHENGDU GUIBAO SCIENCE & TECHNOLOGY CO., LTD.
    Inventors: Qiang Huang, Chonghao Wang, Nan Li, Ting Xiong, Buchun Li, Youzhi Wang
  • HYBRID ORGANOSILICON THERMOPLASTIC ELASTOMER AND PREPARATION METHOD THEREFOR
    Publication number: 20160319065
    Abstract: The present invention discloses a hybrid organic silicon thermoplastic elastomer and a preparation method thereof. The copolymer, namely the elastomer, has a structural formula as shown in formula I. In the preparation method, the preparation proceeds in a solution or main body polymerization system through organopolysiloxane with two functionalized ends, a compound with a structural formula of OCN—Y—NCO, a branched compound with a structural formula of and a compound with a structural formula of NH2—Z—NH2, which can be added or not. The softening temperature of the copolymer is in a range of 40° C.˜190° C., and the present invention has high processing mobility.
    Type: Application
    Filed: December 26, 2014
    Publication date: November 3, 2016
    Inventors: Qiang HUANG, Chonghao WANG, Nan LI, Ting XIONG, Buchun LI, Youzhi WANG