Patents by Inventor Chongsoo Park

Chongsoo Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120101246
    Abstract: An epoxy resin represented by general formula (I) satisfying numerical formula (1) with hydrolytic halogen of 0.05 wt. % or less, said epoxy resin produced as follows: after dissolving 0.8 to 1.3 mole of epihalohydrin to 1 mole of divalent phenol in a solvent, a pre-reaction is performed over 30 to 70 minutes by adding dropwise 0.25-0.35 mole of 30˜50% aqueous solution of alkali metal hydroxide over 30 to 70 minutes thereto, and thereafter, 0.65-0.75 mole of the remaining 30˜50% aqueous solution of alkali metal hydroxide is added dropwise over about 1 hour to complete the reaction over 1 to 3 hours. 0.5?X/Y?1.
    Type: Application
    Filed: October 24, 2011
    Publication date: April 26, 2012
    Applicant: KUKDO CHEMICAL CO., LTD. (KOREAN CORPORATION)
    Inventors: Masayoshi HANAFUSA, Shuya SHINOHARA, Chongsoo PARK, Kyungho Park, Deuk-sung BAE, Seok LEE
  • Patent number: 6890974
    Abstract: The present invention relates to a powder coating composition containing a low temperature curable epoxy resin, and more particularly to a powder coating composition containing a low temperature curable epoxy resin, which can be readily cured at a low temperature, thereby capable of being applied to coating objects that are noneconomic al in terms of workability at an elevated temperature, or are thermally sensitive. The present invention provides a powder coating composition comprising 100 parts by weight of a low temperature curable epoxy resin; 30 to 500 parts by weight of curing.
    Type: Grant
    Filed: December 18, 2002
    Date of Patent: May 10, 2005
    Assignee: Kukdo Chemical Co., Ltd.
    Inventors: Chongsoo Park, Youngsoo Park, Jinwoo Kim
  • Patent number: 6593401
    Abstract: The present invention relates to a powder coating composition containing a low temperature curable epoxy resin, and more particularly to a powder coating composition containing a low temperature curable epoxy resin, which can be readily cured at a low temperature, thereby capable of being applied to coating objects that are noneconomical in terms of workability at an elevated temperature, or are thermally sensitive. The present invention provides a powder coating composition comprising 100 parts by weight of a low temperature curable epoxy resin; 30 to 500 parts by weight of a bisphenol-A curing agent or a polyester curing agent; 0.1 to 20 parts by weight of a defoaming agent; and 0.1 to 20 parts by weight of a leveling agent.
    Type: Grant
    Filed: May 6, 2002
    Date of Patent: July 15, 2003
    Assignee: Kukdo Chemical Co., Ltd.
    Inventors: Chongsoo Park, Jinseon Yu, Youngsoo Park, Jinwoo Kim
  • Publication number: 20030130441
    Abstract: The present invention relates to a powder coating composition containing a low temperature curable epoxy resin, and more particularly to a powder coating composition containing a low temperature curable epoxy resin, which can be readily cured at a low temperature, thereby capable of being applied to coating objects that are noneconomical in terms of workability at an elevated temperature, or are thermally sensitive. The present invention provides a powder coating composition comprising 100 parts by weight of a low temperature curable epoxy resin; 30 to 500 parts by weight of curing.
    Type: Application
    Filed: December 18, 2002
    Publication date: July 10, 2003
    Applicant: KUKDO CHEMICAL CO., LTD.
    Inventors: Chongsoo Park, Youngsoo Park, Jinwoo Kim
  • Patent number: 6534601
    Abstract: Disclosed is an epoxy resin modified with phosphorus and silicon having an synergistically improved flame retardant property, prepared by reacting an epoxy resin with phosphorus and silicon. The contents of phosphorus and silicon in the epoxy resin are 2.0 wt % to 3.2 wt % and 0.5 wt % to 2.2 wt %, respectively. The epoxy resin according to the present invention will be applicable to the preparation of electrical circuit boards.
    Type: Grant
    Filed: December 31, 2001
    Date of Patent: March 18, 2003
    Assignee: Kukdo Chemical Co., Ltd.
    Inventors: Chongsoo Park, Jaeho Choi, Bonggoo Choi, Taekyoo Shin