Abstract: A method and system for managing process jobs in a semiconductor fabrication facility is described. In one embodiment, the method includes receiving a plurality of process jobs associated with one or more priorities. The method further includes executing the plurality of process jobs in an order reflecting the priorities. The order is modifiable in real time upon receiving a new process job with a priority higher than the priorities of the plurality of process jobs.

Abstract: Methods and apparatus for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput and repeatable wafer processing history are provided. In one embodiment a first substrate is transferred from a first position to a second position and then the first substrate is transferred from the second position to a third position using a first robot. A second substrate is transferred from a first position to a second position and then the second substrate is transferred from the second position to a third position using a second robot. The movement of the first and second robots is synchronized so that the movement from the first position to the second position by the first and second robot is performed within a first time interval.

Abstract: A method and system for managing process jobs in a semiconductor fabrication facility is described. In one embodiment, the method includes receiving a plurality of process jobs associated with one or more priorities. The method further includes executing the plurality of process jobs in an order reflecting the priorities. The order is modifiable in real time upon receiving a new process job with a priority higher than the priorities of the plurality of process jobs.

Abstract: Methods and apparatus for increasing the processing throughput of multiple lots of semiconductor wafers through a cluster tool while maintaining a constant wafer history for each lot are provided. A first lot of wafers containing one through n-th wafers is introduced into a cluster tool containing one or more processing chambers. The first lot of wafers is processed for a first time period. A second lot of wafers containing one through n-th wafers is introduced into the cluster tool prior to completion of the first time period, wherein the second lot is introduced so as to minimize a time gap between the n-th wafer of the first lot of wafers and the first wafer of the second lot of wafers while maintaining a first constant wafer history for each wafer within the first lot and maintaining a second constant wafer history for each wafer in the second lot.