Abstract: This invention relates to a curable epoxy composition comprising an epoxy resin, a core-shell rubber, a capped polyurethane prepolymer, a hardener, an accelerator, a multifunctional epoxy-terminated prepolymer, along with related methods of making and using the same. The curable epoxy compositions could be used as structural adhesives after curing, for example, in automotive industrial bonding applications, which provides very good impact peel strength within wide temperature range, good storage ability and the curable epoxy compositions could be cured at low temperature.

Abstract: A thin-film transistor (TFT) panel and a test method are disclosed. The TFT panel includes: m×n bonding pads, where m and n are both natural numbers greater than or equal to 1, and the m×n bonding pads are arranged correspondingly to and electrically connected to TFT units in a TFT active area; a TFT test area including m drive pads, n test pads, and m×n TFT devices, where the m×n TFT devices are divided into n groups, each of which includes m TFT devices. the m TFT devices in each group corresponding to and are electrically connected to the m drive pads and m bonding pads respectively, and the m TFT devices in each group are electrically connected to a same test pad of the n test pads. The m×n bonding pads that were originally bonded by pressure once are tested in m sessions.

Abstract: A thin-film transistor (TFT) panel and a test method are disclosed. The TFT panel includes: m×n bonding pads, where m and n are both natural numbers greater than or equal to 1, and the m×n bonding pads are arranged correspondingly to and electrically connected to TFT units in a TFT active area; a TFT test area including m drive pads, n test pads, and m×n TFT devices, where the m×n TFT devices are divided into n groups, each of which includes m TFT devices. the m TFT devices in each group corresponding to and are electrically connected to the m drive pads and m bonding pads respectively, and the m TFT devices in each group are electrically connected to a same test pad of the n test pads. The m×n bonding pads that were originally bonded by pressure once are tested in m sessions.