Patents by Inventor Choo Kuan Lee

Choo Kuan Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaged IC device comprising an embedded flex circuit on leadframe, and methods of making same
    Patent number: 8217505
    Abstract: A device is disclosed which includes a flexible material including at least one conductive wiring trace, a first die including at least an integrated circuit, the first die being positioned above a portion of the flexible material, and an encapsulant material that covers the first die and at least a portion of the flexible material. A method is disclosed which includes positioning a first die above a portion of a flexible material, the first die including an integrated circuit and the flexible material including at least one conductive wiring trace, and forming an encapsulant material that covers the first die and at least a portion of the flexible material, wherein at least a portion of the flexible material extends beyond the encapsulant material.
    Type: Grant
    Filed: September 2, 2010
    Date of Patent: July 10, 2012
    Assignee: Micron Technology, Inc.
    Inventors: Choo Kuan Lee, Chin Hui Chong, David J. Corisis