Patents by Inventor Choon-goang Kim

Choon-goang Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Retainer rings of chemical mechanical polishing apparatus and methods of manufacturing the same
    Patent number: 8858302
    Abstract: A retainer ring of a chemical mechanical polishing apparatus includes a base portion having a ring shape, the base portion including a pressurizing surface and a combining surface opposite the pressurizing surface, slurry inflowing portions on the pressurizing surface of the base portion, the slurry inflowing portions having groove shapes, and minute grooves at least on a surface portion of the slurry inflowing portions.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: October 14, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Choon-Goang Kim
  • RETAINER RINGS OF CHEMICAL MECHANICAL POLISHING APPARATUS AND METHODS OF MANUFACTURING THE SAME
    Publication number: 20120309276
    Abstract: A retainer ring of a chemical mechanical polishing apparatus includes a base portion having a ring shape, the base portion including a pressurizing surface and a combining surface opposite the pressurizing surface, slurry inflowing portions on the pressurizing surface of the base portion, the slurry inflowing portions having groove shapes, and minute grooves at least on a surface portion of the slurry inflowing portions.
    Type: Application
    Filed: May 23, 2012
    Publication date: December 6, 2012
    Inventor: Choon-Goang KIM
  • Chemical mechanical polishing devices, pad conditioner assembly and polishing pad conditioning method thereof
    Patent number: 7559824
    Abstract: Chemical mechanical polishing (CMP) devices, a pad conditioner assembly and a polishing pad conditioning method thereof are provided. The CMP device planarizes a wafer by rotating a carrier, which has a wafer mounted on a lower surface of the carrier, over a rotating polishing table while supplying a slurry onto a polishing pad attached to an upper surface of the rotating polishing table. The CMP device may include a pad conditioner assembly that conditions the polishing pad by supplying a pad conditioning liquid onto the polishing pad and simultaneously transferring a megasonic vibration to the pad conditioning liquid to remove foreign substances from a surface of the polishing pad.
    Type: Grant
    Filed: July 28, 2006
    Date of Patent: July 14, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Moo-yong Park, Tai-hyoung Kim, Choon-goang Kim, Dong-Il Kim
  • Chemical mechanical polishing devices, pad conditioner assembly and polishing pad conditioning method thereof
    Publication number: 20070077871
    Abstract: Chemical mechanical polishing (CMP) devices, a pad conditioner assembly and a polishing pad conditioning method thereof are provided. The CMP device planarizes a wafer by rotating a carrier, which has a wafer mounted on a lower surface of the carrier, over a rotating polishing table while supplying a slurry onto a polishing pad attached to an upper surface of the rotating polishing table. The CMP device may include a pad conditioner assembly that conditions the polishing pad by supplying a pad conditioning liquid onto the polishing pad and simultaneously transferring a megasonic vibration to the pad conditioning liquid to remove foreign substances from a surface of the polishing pad.
    Type: Application
    Filed: July 28, 2006
    Publication date: April 5, 2007
    Inventors: Moo-Yong Park, Tai-hyoung Kim, Choon-goang Kim, Dong-Il Kim