Abstract: A semiconductor component includes a substrate (1) having a chip side and a solder ball side. A semiconductor chip (2) is mounted with an adhesive (3) on the chip side of the substrate. The semiconductor chip is electrically conductively connected to a conductor structure of the substrate (1). Ball pads are disposed over the solder ball side of the substrate (1). The ball pads are electrically conductively connected to a conductor structure on the substrate and suitable for application of solder balls (5). The substrate is provided with a bond channel (8). Wire loops (7) are drawn from bond pads on the semiconductor chip to the conductor structure. The substrate is provided with a reservoir (15) at the rim portion. A sealing mold cap (4), made of a mold compound, is provided on the chip-side made of a mold compound and a sealing mold cap projects into the reservoir (15).