Patents by Inventor Choon Kait Andrew Tek

Choon Kait Andrew Tek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10641818
    Abstract: Illustrative embodiments disclosed herein pertain to a capacitive coupler that is custom fabricated to provide shape conformability with a component under test. The shape conformability allows the capacitive coupler to provide a high level of capacitive coupling between an electrode in the capacitive coupler and a metal part contained in the component. The electrode in the capacitive coupler has one or more characteristics such as a shape and an orientation, that are defined by utilizing the metal part as a template during fabrication of the capacitive coupler. In one exemplary embodiment, the electrode in the capacitive coupler has a form factor that substantially matches a form factor of the metal part contained in the component. In another exemplary embodiment, the metal part is oriented at a non-orthogonal angle with respect to a major surface of a printed circuit board upon which the component is mounted.
    Type: Grant
    Filed: August 27, 2018
    Date of Patent: May 5, 2020
    Assignee: Keysight Technologies, Inc.
    Inventors: Choon Kait Andrew Tek, Mei Siem Wong
  • Publication number: 20200064395
    Abstract: Illustrative embodiments disclosed herein pertain to a capacitive coupler that is custom fabricated to provide shape conformability with a component under test. The shape conformability allows the capacitive coupler to provide a high level of capacitive coupling between an electrode in the capacitive coupler and a metal part contained in the component. The electrode in the capacitive coupler has one or more characteristics such as a shape and an orientation, that are defined by utilizing the metal part as a template during fabrication of the capacitive coupler. In one exemplary embodiment, the electrode in the capacitive coupler has a form factor that substantially matches a form factor of the metal part contained in the component. In another exemplary embodiment, the metal part is oriented at a non-orthogonal angle with respect to a major surface of a printed circuit board upon which the component is mounted.
    Type: Application
    Filed: August 27, 2018
    Publication date: February 27, 2020
    Inventors: Choon Kait Andrew Tek, Mei Siem Wong