Patents by Inventor Choon Keun Lee
Choon Keun Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7666292Abstract: The present invention relates to a method of manufacturing a printed circuit board using an imprinting process, in which a pattern having a large area can be uniformly formed using a plurality of molds, and the plurality of molds is sequentially removed, thereby solving problems occurring in release of the molds from an insulating layer.Type: GrantFiled: January 17, 2006Date of Patent: February 23, 2010Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Choon Cho, Il Sang Maeng, Choon Keun Lee, Seung Hyun Ra
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Patent number: 7653990Abstract: A manufacturing method of printed circuit board print is disclosed. A method of manufacturing a PCB which includes providing an imprinting stamper with a relievo pattern formed in correspondence with a circuit pattern data using the circuit pattern data, forming an intaglio pattern corresponding to the relievo pattern by pressing the imprinting stamper on an insulation layer, and forming a circuit pattern by printing conductive ink in the intaglio pattern by an ink-jet method using the circuit pattern data, allows the forming of a circuit pattern to a required thickness by injecting conductive ink in a groove processed by the imprint method, and prevents the spreading of ink and the distortion of the pattern shape in the curing process for conductive ink containing metal Also, the circuit pattern CAD data used in the manufacturing of an imprinting stamper can be utilized again in the ink-jet printing process.Type: GrantFiled: April 13, 2007Date of Patent: February 2, 2010Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Choon-Keun Lee, Myeong-Ho Hong, Senug-Hyun Ra
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Patent number: 7644496Abstract: A manufacturing method for imprinting stamper is disclosed. The manufacturing method includes forming a plurality of concave patterns on an insulation layer, forming a stamper by filling copper in the concave patterns, separating the stamper from the insulation layer, providing roughness on the surface of the stamper, can separate the stamper from the insulation layer, can prevent the deformation of the stamper and can manufacture pluralities of stampers repeatedly.Type: GrantFiled: October 10, 2007Date of Patent: January 12, 2010Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jeong-Bok Kwak, Seung-Hyun Ra, Choon-Keun Lee, Jae-Choon Cho, Sang-Moon Lee
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Publication number: 20090183903Abstract: A printed circuit board print (PCB) having an insulation layer; an intaglio pattern formed by depressing a part of the insulation layer corresponding to a location where a circuit pattern is to be formed; and conductive ink forming the circuit pattern by filling the intaglio pattern. A method of manufacturing the PCB includes providing an imprinting stamper with a relievo pattern formed in correspondence with a circuit pattern data using the circuit pattern data, forming an intaglio pattern corresponding to the relievo pattern by pressing the imprinting stamper on an insulation layer, and forming a circuit pattern by printing conductive ink in the intaglio pattern by an ink-jet method using the circuit pattern data, allows the forming of a circuit pattern to a required thickness by injecting conductive ink in a groove processed by the imprint method, and prevents the spreading of ink and the distortion of the pattern shape in the curing process for conductive ink containing metal.Type: ApplicationFiled: March 18, 2009Publication date: July 23, 2009Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTDInventors: Choon-Keun Lee, Myeong-Ho Hong, Senug-Hyun Ra
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Patent number: 7562447Abstract: Disclosed is a method of manufacturing a printed circuit board for fine circuit formation, in which an unnecessary metal layer formed on the upper portion of a circuit pattern is removed through mechanical polishing and then chemical etching. In place of expensive chemical mechanical polishing, in the method of the invention, mechanical polishing and chemical etching are continuously applied to thus sequentially remove and planarize the unnecessary metal layer. Thereby, through an inexpensive, simple, and continuous process, the planarization procedure can be precisely performed, thus making it possible to apply the method to large areas and economically realize a fine circuit pattern.Type: GrantFiled: March 27, 2007Date of Patent: July 21, 2009Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Choon Keun Lee, Seung Hyun Ra, Sang Moon Lee, Jung Woo Lee, Jeong Bok Kwak, Jae Choon Cho, Chi Seong Kim
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Publication number: 20090151988Abstract: An FPCB and a method of manufacturing the same, in which an electrical signal-conductive portion of the FPCB is subjected to little stress so as not to be broken by fatigue in spite of repeated bending of the FPCB, thereby increasing the lifetime of the FPCB.Type: ApplicationFiled: June 20, 2008Publication date: June 18, 2009Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyung Ho Lee, Se Min Oh, Chang Hwan Choi, Choon Keun Lee, Jeong Yeol Moon, Jong Rip Kim
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Publication number: 20080086877Abstract: A manufacturing method for imprinting stamper is disclosed. The manufacturing method includes forming a plurality of concave patterns on an insulation layer, forming a stamper by filling copper in the concave patterns, separating the stamper from the insulation layer, providing roughness on the surface of the stamper, can separate the stamper from the insulation layer, can prevent the deformation of the stamper and can manufacture pluralities of stampers repeatedly.Type: ApplicationFiled: October 10, 2007Publication date: April 17, 2008Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jeong-Bok Kwak, Seung-Hyun Ra, Choon-Keun Lee, Jae-Choon Cho, Sang-Moon Lee
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Publication number: 20080057444Abstract: A method of manufacturing a broad stamper is disclosed. Using a method that includes: stacking a first mask, in which a first pattern is perforated, on a positive photoresist layer; exposing an upper surface of the first mask to light; developing the positive photoresist layer to form an intaglio; and molding such that a relievo is formed, which is in correspondence with the intaglio, a broad stamper having multiple levels can be manufactured with a simple process.Type: ApplicationFiled: August 29, 2007Publication date: March 6, 2008Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seung-Hyun Ra, Choon-Keun Lee, Sang-Moon Kee, Jae-Choon Cho
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Publication number: 20080034581Abstract: A method for manufacturing a printed circuit board is disclosed. With a method for manufacturing a printed circuit board which includes loading an insulation substrate in which an align mark is formed, loading an imprinting mold in which a first align hole is perforated in correspondence with the align mark, aligning the insulation substrate and the imprinting mold by perceiving the align mark through the first align hole, and compressing the imprinting mold and the insulation substrate together such that the intaglio pattern is formed in correspondence with the raised pattern, it is possible is to use an existing optical system for an imprinting process in aligning an opaque imprinting mold and an insulation substrate, without installing expensive alignment instruments, and to manufacture several insulation substrates having circuit patterns by sequentially loading and aligning several imprinting molds and insulation substrates and compressing simultaneously.Type: ApplicationFiled: August 10, 2007Publication date: February 14, 2008Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seung-Hyun Ra, Choon-Keun Lee, Sang-Moon Kee, Jae-Choon Cho
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Publication number: 20080016686Abstract: A manufacturing method of printed circuit board print is disclosed. A method of manufacturing a PCB which includes providing an imprinting stamper with a relievo pattern formed in correspondence with a circuit pattern data using the circuit pattern data, forming an intaglio pattern corresponding to the relievo pattern by pressing the imprinting stamper on an insulation layer, and forming a circuit pattern by printing conductive ink in the intaglio pattern by an ink-jet method using the circuit pattern data, allows the forming of a circuit pattern to a required thickness by injecting conductive ink in a groove processed by the imprint method, and prevents the spreading of ink and the distortion of the pattern shape in the curing process for conductive ink containing metal Also, the circuit pattern CAD data used in the manufacturing of an imprinting stamper can be utilized again in the ink-jet printing process.Type: ApplicationFiled: April 13, 2007Publication date: January 24, 2008Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Choon-Keun Lee, Myeong-Ho Hong, Senug-Hyun Ra
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Publication number: 20080012168Abstract: A method for manufacturing printed circuit board is disclosed.Type: ApplicationFiled: July 11, 2007Publication date: January 17, 2008Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Senug-Hyun Ra, Myeong-Ho Hong, Hyuk-Soo Lee, Choon-Keun Lee, Sang-Moon Lee, Jae-Choon Cho, Jung-Woo Lee, Jeong-Bok Kwak
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Publication number: 20080008824Abstract: The present invention relates to a method for manufacturing a printed circuit board, more particularly to a method for manufacturing a printed circuit board, in which an oxidant capable of polymerizing conductive polymers is selectively marked on a board using imprinting, and the monomer of a conductive polymer is filled in the selected pattern and polymerized, to provide a conductive polymer wiring pattern. With the method for manufacturing a printed circuit board according to certain aspects of the invention as set forth above, a printed circuit board can be given finer wiring widths to allow a highly integrated, highly efficient printed circuit board. Thus, a printed circuit board (PCB) or a flexible printed circuit boards (FPCB) can be manufactured that is applicable to industrial, clerical, and domestic electric electronic products, by a new technique of forming conductive polymer wiring using imprinting.Type: ApplicationFiled: June 28, 2007Publication date: January 10, 2008Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae-Choon Cho, Myeong-Ho Hong, Senug-Hyun Ra, Hyuk-Soo Lee, Jeong-Bok Kwak, Jung-Woo Lee, Choon-Keun Lee, Sang-Moon Lee
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Publication number: 20070264755Abstract: Disclosed is a method of manufacturing a printed circuit board for fine circuit formation, in which an unnecessary metal layer formed on the upper portion of a circuit pattern is removed through mechanical polishing and then chemical etching. In place of expensive chemical mechanical polishing, in the method of the invention, mechanical polishing and chemical etching are continuously applied to thus sequentially remove and planarize the unnecessary metal layer. Thereby, through an inexpensive, simple, and continuous process, the planarization procedure can be precisely performed, thus making it possible to apply the method to large areas and economically realize a fine circuit pattern.Type: ApplicationFiled: March 27, 2007Publication date: November 15, 2007Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Choon Keun Lee, Seung Hyun Ra, Sang Moon Lee, Jung Woo Lee, Jeong Bok Kwak, Jae Choon Cho, Chi Seong Kim
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Publication number: 20070221942Abstract: Disclosed herein is a Light Emitting Diode (LED) backlight unit without a Printed Circuit board (PCB). The LED backlight unit includes a chassis, insulating resin layer, and one or more light source modules. The insulating resin layer is formed on the chassis. The circuit patterns are formed on the insulating resin layer. The light source modules are mounted on the insulating resin layer and are electrically connected to the circuit patterns. The insulating resin layer has a thickness of 200 ?m or less, and is formed by laminating solid film insulating resin on the chassis or by applying liquid insulating resin to the chassis using a molding method employing spin coating or blade coating. Furthermore, the circuit patterns are formed by filling the engraved circuit patterns of the insulating resin layer with metal material.Type: ApplicationFiled: March 19, 2007Publication date: September 27, 2007Inventors: Gi Ho Jeong, Si Young Yang, Jae Wook Kwon, Jeong Hoon Park, Hyun Ju Yi, Choon Keun Lee
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Publication number: 20070207297Abstract: While releasing property between a resin layer and an imprinting mold is given by using a metal thin film layer, a method for manufacturing a substrate advantageous for forming a conductive layer by plating and a substrate manufactured by the method are provided. According to one aspect of the present invention, a method for manufacturing a substrate by imprinting, the method comprising: laminating a metal thin film layer on top of a resin layer; pressurizing the resin layer and the metal thin film layer by an imprinting mold which comprises a side having a pattern in correspondence with a wiring pattern; curing a resin which forms the resin layer; and removing the imprinting mold from the resin layer and the metal thin film layer, may be presented.Type: ApplicationFiled: March 5, 2007Publication date: September 6, 2007Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Choon-Keun Lee, Myeong-Ho Hong, Seung-Heon Han, Senug-Hyun Ra