Patents by Inventor Choon Peck

Choon Peck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230087215
    Abstract: In one embodiment, a computer-implemented method executed using a server computer comprises receiving from a user computer via a network one or more requests to create one or more subforms that are associated with a digitally stored expense trip preapproval form, each of the subforms being associated with a different type of a travel expense item; in a particular subform among the one or more subforms, receiving input from the user computer specifying a plurality of input values for attributes of the particular subform, the plurality of input values collectively specifying the travel expense item; programmatically transmitting, to a price modeling server, a query comprising the plurality of input values and requesting a cost value for a travel item corresponding to the plurality of input values, and receiving in response to the query a predicted cost of the travel expense item; automatically updating the particular subform to display the predicted cost in the particular subform and to populate the predicted c
    Type: Application
    Filed: September 20, 2022
    Publication date: March 23, 2023
    Inventors: Dan Benson, Choon Peck, Doug Benson, Dawn Fink, Alison Guilbeaux, Valerie Layman
  • Publication number: 20060102032
    Abstract: A printing apparatus with capability for drying printed media is disclosed. The printing apparatus includes a print zone and a post-printing zone, an advancing mechanism for transporting the print medium through the print zone, a print head for ejecting ink onto the medium as the medium is being transported through the print zone, and a heating system for drying the ink ejected onto the medium. The heating system includes a plurality of thermoelectric modules positioned in the print zone or the post-printing zone. Each thermoelectric module has a heat-rejecting surface and a cooling surface. The heat-rejecting surface of each thermoelectric module is positioned to face the medium being transported.
    Type: Application
    Filed: October 29, 2004
    Publication date: May 18, 2006
    Inventors: Peow Ng, Yee Leong, Choon Peck