Patents by Inventor Choong Bin Yim

Choong Bin Yim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • STACKED INTEGRATED CIRCUIT LEADFRAME PACKAGE SYSTEM
    Publication number: 20070108604
    Abstract: A stacked integrated circuit leadframe package system including forming a leadframe, packaging a top integrated circuit on a one side of the leadframe, packaging a bottom integrated circuit on an opposite side of the leadframe, and forming external electrical interconnects on the leadframe.
    Type: Application
    Filed: January 11, 2006
    Publication date: May 17, 2007
    Applicant: STATS CHIPPAC LTD.
    Inventor: Choong Bin Yim
  • Method for fabricating cob type semiconductor package
    Patent number: 6124152
    Abstract: Method for fabricating a COB type semiconductor package, which is suitable for simplifiing a process from wire bonding to milling, including the steps of (1) mounting chips on a COB film having a plurality of bond holes formed therein, (2) electrically connecting the chips to inside portions of the COB film through the bond holes, (3) placing a solid state EMC(Epoxy Molding Compound) on a top surface of each of the chips, and (4) heating the solid state EMC so that the EMC covers wires and the chips.
    Type: Grant
    Filed: October 26, 1998
    Date of Patent: September 26, 2000
    Assignee: LG Semicon Co., Ltd.
    Inventor: Choong Bin Yim