Abstract: A method of packaging a die includes attaching the die to a substrate; underfilling the space between the die and the substrate with a first material, and placing a second material in contact with at least a portion of the die and the substrate after underfilling the space between the die and substrate with the first material. A system includes a semiconductor package having a substrate, a die attached to the substrate, an underfill material positioned between the die and the substrate, and a molding material in contact with at least a portion of the substrate and the die. A heat sink is also in thermal contact with the semiconductor package.

Abstract: According to embodiments of the present invention, a first layer of electrically conductive material may be disposed in a recess in a micro-electromechanical system (MEMS) base. An electrically charged gel network may be disposed in the recess on the first layer of electrically conductive material. A second layer of electrically conductive material may be disposed in the recess on the cross-linked co-polymer gel network. A functionalizer may be disposed on the first and the second layers of electrically conductive material.

Abstract: A method of packaging a die includes attaching the die to a substrate; underfilling the space between the die and the substrate with a first material, and placing a second material in contact with at least a portion of the die and the substrate after underfilling the space between the die and substrate with the first material. A system includes a semiconductor package having a substrate, a die attached to the substrate, an underfill material positioned between the die and the substrate, and a molding material in contact with at least a portion of the substrate and the die. A heat sink is also in thermal contact with the semiconductor package.

Abstract: According to embodiments of the present invention, a first layer of electrically conductive material may be disposed in a recess in a micro-electromechanical system (MEMS) base. An electrically charged gel network may be disposed in the recess on the first layer of electrically conductive material. A second layer of electrically conductive material may be disposed in the recess on the cross-linked co-polymer gel network. A functionalizer may be disposed on the first and the second layers of electrically conductive material.

Abstract: A stress-compensation layer is formed by pressing a solder bump into a compressible film within a mold chase. The stress-compensation layer flows against the solder bump and the compressible film such that at least a portion of the solder ball is embedded in the stress-compensation layer. The compressible film is removed to reveal at least a portion of the solder bump exposed and free of the stress-compensation layer. An article that exhibits a stress-compensation layer with a surface characteristic of the imposed flexible film is also included. A computing system that includes a stress-compensation layer with a surface characteristic of the imposed flexible film is also included.

Abstract: A system for chip packaging includes an adamantoid packaging composition. The adamantoid composition ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In an embodiment, the system includes a packaging composition that alone exhibits a CTE that is characteristic of an inorganic-filled underfill composite previously known. An embodiment is also directed to the assembly of a chip package that uses an adamantoid packaging composition.