Patents by Inventor Choong Hoon Jung

Choong Hoon Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for testing a wafer in a wafer testing process
    Patent number: 9053967
    Abstract: An apparatus for testing a wafer includes a wafer chuck on which the wafer is loaded to perform a wafer test process. The wafer chuck is maintained at a high temperature in a predetermined temperature range. The apparatus for testing a wafer further includes a wafer handling arm supporting the wafer and transferring the wafer to the wafer chuck, and a wafer heating module coupled to the wafer handling arm, arranged parallel to the wafer, and preheating the wafer to be loaded on the wafer chuck.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: June 9, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Choong Hoon Jung, Jong Gu Gil, Woo Kyu Lee, In Seok Hwang
  • APPARATUS FOR TESTING A WAFER
    Publication number: 20140017041
    Abstract: An apparatus for testing a wafer includes a wafer chuck on which the wafer is loaded to perform a wafer test process. The wafer chuck is maintained at a high temperature in a predetermined temperature range. The apparatus for testing a wafer further includes a wafer handling arm supporting the wafer and transferring the wafer to the wafer chuck, and a wafer heating module coupled to the wafer handling arm, arranged parallel to the wafer, and preheating the wafer to be loaded on the wafer chuck.
    Type: Application
    Filed: March 14, 2013
    Publication date: January 16, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Choong Hoon Jung, Jong Gu Gil, Woo Kyu Lee, In Seok Hwang