Abstract: An integrated circuit that is capable of being burn-in tested with an AC stress and a testing method using the same are provided. The integrated circuit includes an address transforming means and a data generating means. The address transforming means transforms the addresses of the memory cell selected and generates an address signal responsive to a clock signal. The data generating means generates a data signal that alternates between a first state and a second state responsive to the clock signal and provides the data signal to the selected memory cell. The integrated circuit includes a switch for coupling the test supply line to the normal supply line during testing and intercepting the test supply line from the normal supply line during normal operations responsive to a control signal. The integrated circuit of the present invention allows a wafer burn-in test by sequentially and repeatedly applying the AC stress to all the memory cells.

Abstract: A semiconductor memory device having memory cells connected with pairs of bit lines and word lines comprises a pre-charging part for pre-charging a pair of bit lines in response to a first state control signal at a stand-by mode of the semiconductor memory device; a bit line charging control part for generating a second state control signal to the pre-charging part when a stand-by current failure occurs due to defect in the pair of bit lines, wherein the second state control signal is independent of a pre-charge relating signal externally applied and the pre-charging part cuts-off a supply voltage from being applied to the pair of bit lines with defect; and a bit line floating prevent part for compensatively fixing potential values of the pair of bit lines with defect so that a cell supply voltage is prevented from being applied to the pair of bit lines with defect at a memory access mode of the semiconductor memory device, so that a hard type defect like a stand-by current failure can be repaired regardless

Abstract: A layout method is provided for a latch-up prevention circuit of a semiconductor memory device which includes the steps of: arranging a cell array at substantially the middle of the device; placing peripheral circuits next to both sides of the cell array; placing a plurality of pads on both sides of the cell array between the peripheral circuits and both edges of the device; and arranging guard rings beneath the plurality of pads. The layout method further includes a plurality of ESD protection transistors disposed axially along the direction as the plurality of pads between the plurality of pads and an edge of the device. And each of guard ring is a NWELL guard ring, and connected to a supply voltage and ground.

Abstract: A reference voltage generating circuit includes a current mirror circuit having first and second current paths formed between a first power source terminal and a second power source terminal in which the current mirror circuit is operated in response to a voltage level of the second current path, a reference voltage output node for providing a reference voltage and being located on the second current path, an active resistance device formed on the first current path to be operated in a linear region of a current-voltage characteristic curve of the active resistance device, and a voltage supply circuit for supplying the active resistance device with an enable voltage to control the active resistance device to be operated in the linear region.

Abstract: A semiconductor memory device is disclosed. The device is comprised of a plurality of word lines; a plurality of bit lines arranged in perpendicular to the word lines. In addition, a plurality of supply voltage lines extend in the same direction as the bit lines. Also, a plurality of first ground voltage lines are arranged in the same direction as the bit lines. Further, a plurality of second ground voltage lines are arranged in the same direction as the word lines. A plurality of memory cells are each connected between one of the word lines and one of the bit lines. Here, the ground voltage lines are arranged in a matrix shape to reduce the resistance of the ground voltage line and secure the margin between the supply voltage level and the ground voltage level of the data latched by the memory cells to thereby prevent an operational failure of the device.

Abstract: A data output circuit includes a periphery circuit connected between a supply voltage and a first ground voltage line and an output driver connected between a supply voltage and a second ground voltage line. The periphery circuit receives a first input signal and generates a first output signal on a node responsive to the first input signal, and the output driver receives a second input signal and the first output signal and generates a second output signal on an output pin in response thereto. A discharge circuit is coupled with the first ground voltage line wherein the discharge circuit allows current to flow from the first ground voltage line and wherein the discharge circuit blocks current flow to the first ground voltage line. Related methods are also discussed.

Abstract: A semiconductor memory device includes a plurality of memory cell array blocks, an address transition detecting pulse generator to generate address transition detecting pulse signals by detecting the transition of a plurality of addresses, a global row decoder having a plurality of groups of pre-decoders and a main decoder to generate a plurality of global word line signals of a plurality of memory cell array blocks by decoding the plurality of addresses, and a plurality of block row decoders having a plurality of decoding cells to respond to block control signals for selecting a plurality of memory cell array blocks and a plurality of pulse control signals combined with the address transition detecting pulse signals to output a plurality of global word line signals generated by the global row decoder as a plurality of local word line signals.

Abstract: A parallel test circuit for a semiconductor memory device includes multiple data input pads, multiple data input buffers respectively connected to the data input pads for receiving write data in response to a chip selection signal during normal operation, and a switching circuit for electrically connecting the data input pads to each other in response to a current leakage test signal applied to the circuit. The circuit enables the detection of leakage current in the input data buffers at the same time that a parallel data writing test is performed, thereby reducing the total time required to test the device.

Abstract: A CMOS input buffer for semiconductor devices, that is capable of protecting its MOS transistors from gate oxide breakdown due to the application of high voltage greater than a normal power supply voltage.

Abstract: A data output circuit includes a periphery circuit connected between a supply voltage and a first ground voltage line and an output driver connected between a supply voltage and a second ground voltage line. The periphery circuit receives a first input signal and generates a first output signal on a node responsive to the first input signal, and the output driver receives a second input signal and the first output signal and generates a second output signal on an output pin in response thereto. A discharge circuit is coupled with the first ground voltage line wherein the discharge circuit allows current to flow from the first ground voltage line and wherein the discharge circuit blocks current flow to the first ground voltage line. Related methods are also discussed.

Abstract: A redundancy circuit for a semiconductor device comprises a circuit having variable impedance changed in accordance with a chip selecting signal. The variable impedance circuit has a low impedance when the chip selecting signal is at a low level and a high impedance when the chip selecting signal is at a high level. Therefore, when the device is in a standby state, no static current flows, and when the chip is in an active state current of less than several micro amperes flows. Thus, the power dissipation of the redundancy circuit can be reduced.

Abstract: A static random access memory (SRAM) device comprises an array of memory cells, a plurality of bit line precharge circuit for selectively delivering current to bit lines in response to a pair of control signals, during normal and burn-in test modes, and a burn-in current source circuit for selectively delivering current to the memory cells selected by the word lines along with the precharge circuit, in response to the control signals, during the burn-in test mode. In burn-in write operation, memory cells can be supplied with enough cell current without large increasing of chip size and power consumption in normal operation mode.

Abstract: The present invention relates to a circuit and method for write recovery control for suppressing malfunctions during a write recovery operation. The circuit is for use in a semiconductor memory device including a plurality of memory cells connected in a matrix form to a plurality of word lines and paired bit lines. The circuit comprises a variable load circuit connected to the bit lines, for controlling the voltage level of the bit lines in response to a write enable signal, a word line selector for selecting a predetermined word line in response to an input address, and a delay controller for providing a delay control signal to the word line selector so as to delay activation of the word line selector during the write recovery operation.

Abstract: An SRAM, which includes a plurality of bit line pairs, a memory cell connected between each pair of the bit lines, and an address transition detection circuit for detecting transition of the externally applied address signal to generate a detection pulse signal, is provided with an improved bit line precharge circuit requiring only two transistors per bit line pair. The new precharge circuit is controlled by a bit line precharge control signal generator for generating a control signal determined by a ratio of impedances connected between a source voltage and ground voltage.

Abstract: A redundancy circuit of the semiconductor memory device having a normal memory cell array for storing data, a redundant memory cell for repairing the fail cells in the normal memory, cell array, a normal decoder for receiving addresses and designating the normal memory cell, a redundancy decoder for selecting the redundant memory cell.

Abstract: The present invention pertains to semiconductor memory devices and more particularly to a burn-in circuit of such devices and burn-in method which improve reliability of a static random access memory RAM.

Abstract: A semiconductor memory device with a redundancy circuit comprising fuses for selectively blocking the supply of the power voltage to the bit line pair, in order to minimize the power consumption originated from the contacting of the bit line to ground caused by a processing failure on the bit lines in stand-by state even though a column replacement is performed.

Abstract: A data output buffer includes a data driving circuit having a pull-up transistor responsive to a first signal and a pull-down transistor responsive to a second signal, a first control circuit for regulating the slope of the first signal to be less steep after reaching the threshold of the pull-up transistor than before reaching the threshold of the pull-up transistor, and a second control circuit for regulating the slope of the second signal to be less steep after reaching the threshold of the pull-down transistor than before reaching the threshold of the pull-down transistor. As a result, noise generated by the transition of the output signal of the data output buffer is reduced without affecting operation speed.