Patents by Inventor Choong-Won Lee

Choong-Won Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230160889
    Abstract: The present invention relates to a method and system for screening and separating biological specimens. The screening and separating method and system provide reliable results based on information related to the types, shapes, and positions of labeled products provided by an agent for accurate screening. In addition, the information related to the types, shapes, and positions can be combined to determine objective indices for the state of a target specimen, enabling rapid selection of the target specimen. The method and system for screening and separating biological specimens according to the present invention use an agent optimized to accurately and effectively create information on the selection of a target specimen and process images based on information on images stored in a server, enabling sensitive and highly reproducible screening evaluation.
    Type: Application
    Filed: March 18, 2019
    Publication date: May 25, 2023
    Inventors: Sung Hoon KWON, Dae Won LEE, Yong Ju LEE, Ok Ju KIM, Choong Won LEE
  • Patent number: 8042751
    Abstract: A nozzle system for an injector may include a casing that has an inlet through which liquid flows and an injector outlet through which liquid is outwardly injected, a swirler that is disposed inside the casing and includes at least one swirl groove formed in the exterior circumference thereof through which liquid passes and a swirl chamber formed between an end portion thereof and the injector outlet, and a needle for controlling liquid injection whereby swirl torque is generated when the liquid flows into the swirl chamber through the swirl groove and the liquid swirls in the swirl chamber.
    Type: Grant
    Filed: November 7, 2008
    Date of Patent: October 25, 2011
    Assignee: Hyundai Motor Company
    Inventors: Myung Jun Lee, Chang Il Kim, Choong-Won Lee
  • Publication number: 20090140077
    Abstract: A nozzle system for an injector may include a casing that has an inlet through which liquid flows and an injector outlet through which liquid is outwardly injected, a swirler that is disposed inside the casing and includes at least one swirl groove formed in the exterior circumference thereof through which liquid passes and a swirl chamber formed between an end portion thereof and the injector outlet, and a needle for controlling liquid injection whereby swirl torque is generated when the liquid flows into the swirl chamber through the swirl groove and the liquid swirls in the swirl chamber.
    Type: Application
    Filed: November 7, 2008
    Publication date: June 4, 2009
    Applicant: Hyundai Motor Company
    Inventors: Myung Jun Lee, Chang Il Kim, Choong-Won Lee
  • Patent number: 6685800
    Abstract: Disclosed is an apparatus for generating ICP, which has a heater having a hot wire as a heating source for heating elements in a chamber and inner wall of the chamber and also efficiently transfers heat of the heater through a heat transferring gas to the elements in the chamber and the inner wall of the chamber. According to the present invention, the elements in the chamber and the inner wall of the chamber can be heated up to a temperature of about 200° C., thereby reducing the adhesion of the by-product served as the source generating the undesirable particles. In addition, since the hot wire having a longer life span than the halogen lamp is used as heat radiating means, the life span of the apparatus is also increased.
    Type: Grant
    Filed: November 14, 2001
    Date of Patent: February 3, 2004
    Assignee: Jusung Engineering Co. Ltd.
    Inventors: Hong Seub Kim, Gi Chung Kwon, Sun Seok Han, Choong Won Lee, Sung Weon Lee, Hong Sik Byun
  • Patent number: 6540129
    Abstract: An apparatus and method for manufacturing solder balls used for an electrical and/or mechanical connection between a semiconductor chip and a substrate are provided. The apparatus includes a melting furnace having a nozzle through which a molten solder paste flows and drops, for producing solder balls; a vibrating mechanism attached to the nozzle of the melting furnace, for applying vibration to the nozzle; and a vibration controlling mechanism for controlling the vibration frequency of the vibrating mechanism to adjust the size of the solder balls dropped from the nozzle. The method includes the steps of setting a vibration frequency according to a desired solder ball size, applying vibration to a nozzle with the set vibration frequency, making the molten solder paste flow through the nozzle to manufacture solder balls of a predetermined size according to the vibration frequency, and measuring the size of the manufactured solder balls.
    Type: Grant
    Filed: July 10, 2001
    Date of Patent: April 1, 2003
    Assignee: Spraytech, Ltd.
    Inventor: Choong-Won Lee
  • Publication number: 20020088548
    Abstract: Disclosed is an apparatus for generating ICP, which has a heater having a hot wire as a heating source for heating elements in a chamber and inner wall of the chamber and also efficiently transfers heat of the heater through a heat transferring gas to the elements in the chamber and the inner wall of the chamber. According to the present invention, the elements in the chamber and the inner wall of the chamber can be heated up to a temperature of about 200° C., thereby reducing the adhesion of the by-product served as the source generating the undesirable particles. In addition, since the hot wire having a longer life span than the halogen lamp is used as heat radiating means, the life span of the apparatus is also increased.
    Type: Application
    Filed: November 14, 2001
    Publication date: July 11, 2002
    Applicant: JUSUNG ENGINEERING CO., LTD.
    Inventors: Hong Seub Kim, Gi Chung Kwon, Sun Seok Han, Choong Won Lee, Sung Weon Lee, Hong Sik Byun
  • Publication number: 20020005429
    Abstract: An apparatus and method for manufacturing solder balls used for an electrical and/or mechanical connection between a semiconductor chip and a substrate are provided. The apparatus includes a melting furnace having a nozzle through which a molten solder paste flows and drops, for producing solder balls; a vibrating mechanism attached to the nozzle of the melting furnace, for applying vibration to the nozzle; and a vibration controlling mechanism for controlling the vibration frequency of the vibrating mechanism to adjust the size of the solder balls dropped from the nozzle. The method includes the steps of setting a vibration frequency according to a desired solder ball size, applying vibration to a nozzle with the set vibration frequency, making the molten solder paste flow through the nozzle to manufacture solder balls of a predetermined size according to the vibration frequency, and measuring the size of the manufactured solder balls.
    Type: Application
    Filed: July 10, 2001
    Publication date: January 17, 2002
    Inventor: Choong-Won Lee