Abstract: A multilayer electronic component includes: a body including a capacitance forming portion in which dielectric layers and internal electrodes are alternately disposed in a first direction, and cover portions disposed on an upper surface and a lower surface of the capacitance forming portion, respectively, in the first direction; and external electrodes disposed on the body, wherein the cover portion includes a plurality of dielectric grains and a plurality of pores, and Gn/Pn is more than 10 and less than 30, in which Gn is the number of dielectric grains included in the cover portion and Pn is the number of pores included in the cover portion.

Abstract: The present invention relates to a binding update identifier sub-option field configuration method and a binding update information configuration method. In the method, a binding update identifier sub-option field including current used interface and data characteristics and corresponding to one interface of the plurality of interfaces is generated, the binding update identifier sub-option field is transmitted to a home agent and a correspondent node, a care-of address corresponding to a binding update identifier is stored, and binding update is performed.