Abstract: An organic light emitting diode display device includes: a substrate defining a plurality of pixels having a luminous area and a non-luminous area; an antireflection layer formed on the substrate and including at least one metallic layer and at least one insulating layer; a thin film transistor formed on the antireflection layer in the non-luminous area and including a gate electrode or a metal line on the antireflection layer in the non-luminous area; a passivation layer formed on the thin film transistor; a color refiner formed on the passivation layer in the luminous area; a light blocking member on the passivation layer in the non-luminous area; an organic light emitting layer; and a cathode and an anode electrodes.

Abstract: An organic light emitting diode display device includes a substrate; an antireflection layer on a first surface of the substrate and including a metallic layer and an insulating layer; a driving element portion on the antireflection layer and including thin film transistors and metallic lines; and an organic light emitting portion driven by the driving element portion.

Abstract: An organic light emitting display device (OLED) includes: a multiple display in which a plurality of panels operate as a single display, wherein each of the panels comprise a substrate and a pixel; and a polarizing plate attached to the multiple display to bond the plurality of panels as a single panel, wherein the panels are divided into (i) display areas in which pixels are formed, and (ii) non-display areas surrounding the display areas, and at least two adjacent panels at an interpanel boundary are folded in the adjacent non-display areas to reduce the non-display areas.

Abstract: An organic electro-luminescence display device and a method for fabricating the same are provided. A first substrate and a second substrate are sealed by a sealant. An organic electro-luminescent diode is formed on the first substrate. The sealant contains a frit glass and a light-heat converter. The frit glass can reduce the moisture and oxygen transmission rate by preventing the organic electro-luminescent diode from being thermally decomposed during a curing process. Since the two substrates are encapsulated by the frit glass, the lifetime and reliability of the organic electro-luminescence display device can be increased.

Abstract: An organic light emitting diode display device includes: a substrate defining a plurality of pixels having a luminous area and a non-luminous area; an antireflection layer formed on the substrate and including at least one metallic layer and at least one insulating layer; a thin film transistor formed on the antireflection layer in the non-luminous area and including a gate electrode or a metal line on the antireflection layer in the non-luminous area; a passivation layer formed on the thin film transistor; a color refiner formed on the passivation layer in the luminous area; a light blocking member on the passivation layer in the non-luminous area; an organic light emitting layer; and a cathode and an anode electrodes.

Abstract: An organic light emitting display device (OLED) includes: a multiple display in which a plurality of panels operate as a single display, wherein each of the panels comprise a substrate and a pixel; and a polarizing plate attached to the multiple display to bond the plurality of panels as a single panel, wherein the panels are divided into (i) display areas in which pixels are formed, and (ii) non-display areas surrounding the display areas, and at least two adjacent panels at an interpanel boundary are folded in the adjacent non-display areas to reduce the non-display areas.

Abstract: A method for manufacturing light emitting devices is provided. The method may reduce the inner pressure of a laminated image emitting device panel, thereby preventing failure of the panel. The method includes holding a first substrate with a lower chuck located in a vacuum chamber; holding a second substrate with an upper chuck located opposite the first chuck in the vacuum chamber; creating a high vacuum in the vacuum chamber; correcting positions of the first substrate and the second substrate; supplying gas having a temperature of about 50 to about 200° C. into the vacuum chamber; temporarily laminating the first substrate and the second substrate; venting the vacuum chamber; and bonding the first substrate and the second substrate. The panel is laminated after being filled with a heated gas and thus, when it is exposed to room temperature, the mobility of the gas decreases while reducing its initial inner pressure, thereby preventing panel failure.

Abstract: A method of fabricating an organic light emitting display device includes forming a first electrode in both a luminescent region and a part of a non-luminescent region, forming a buffer layer in the non-luminescent region, forming an insulation pattern on the buffer layer in the non-luminescent region, forming an auxiliary electrode on the insulation pattern in the non-luminescent region, forming an organic emission layer in both the luminescent region and the non-luminescent region, forming a second electrode in both the luminescent region and the non-luminescent region, and applying over-voltage to the auxiliary electrode, the organic emission layer on the auxiliary electrode and the second electrode.

Abstract: An organic light emitting diode display device includes a substrate; an antireflection layer on a first surface of the substrate and including a metallic layer and an insulating layer; a driving element portion on the antireflection layer and including thin film transistors and metallic lines; and an organic light emitting portion driven by the driving element portion.

Abstract: An attaching device and a method of fabricating an organic light emitting device using the same are disclosed. The attaching device includes a process chamber, first and second substrate supporters, a substrate detachable part, and an open-close valve. The first and second substrate supporters are positioned inside the process chamber, load and fix substrates. The substrate detachable part is positioned inside the second substrate supporter, and moves up and down to allow the second substrate supporter to instantaneously receive a physical pressure. The open-close valve is positioned on a portion of the process chamber, and opens and closes the process chamber to control a pressure inside the process chamber.

Abstract: An organic electro-luminescence display device includes a thin film transistor on a first substrate, where the thin film transistor has a drain region and a common electrode connected to the drain region. An organic electro-luminescence diode resides on a second substrate, where the organic electro-luminescence diode includes a spacer covered with a diode electrode. First and second sealant materials reside at a periphery of the first and second substrates, where the first sealant material surrounds the thin film transistor and the organic electro-luminescence diode, and the second sealant material surrounds an outer perimeter of the first sealant material. The first and second substrates are bonded together, such that the common electrode of the thin film transistor contacts the diode electrode of the organic electro-luminescence diode. The bonding process is carried out by sequentially sealing the first sealant material and the second sealant material.

Abstract: An organic light emitting diode (OLED) device according to the present invention includes a first substrate; a first electrode on the first substrate in the pixel region, the first electrode formed of a metal; an organic light-emitting layer on the first electrode; a second electrode on the organic light-emitting layer, the second electrode formed of a transparent conductive material; and a transparent layer on the second electrode, the transparent layer including an inorganic material or a semiconductor material.

Abstract: A dual panel-type organic electroluminescent display device includes a first substrate on which gate and data lines cross each other to define sub-pixels. Array elements are disposed at the sub-pixels on the first substrate. A first electrode is disposed on substantially the entire surface of a second substrate opposing the first substrate. An insulating pattern is disposed on the first electrode, an organic electroluminescent layer is disposed on the first electrode, and a second electrode is disposed on the organic electroluminescent layer at each sub-pixel. A connection pattern connects the array element and the second electrode at each sub-pixel. The connection pattern contacts the second electrode under the insulating pattern.

Abstract: An attaching device and a method of fabricating an organic light emitting device using the same are disclosed. The attaching device includes a process chamber, first and second substrate supporters, a substrate detachable part, and an open-close valve. The first and second substrate supporters are positioned inside the process chamber, load and fix substrates. The substrate detachable part is positioned inside the second substrate supporter, and moves up and down to allow the second substrate supporter to instantaneously receive a physical pressure. The open-close valve is positioned on a portion of the process chamber, and opens and closes the process chamber to control a pressure inside the process chamber.

Abstract: A method for manufacturing light emitting devices is provided. The method may reduce the inner pressure of a laminated image emitting device panel, thereby preventing failure of the panel. The method includes holding a first substrate with a lower chuck located in a vacuum chamber; holding a second substrate with an upper chuck located opposite the first chuck in the vacuum chamber; creating a high vacuum in the vacuum chamber; correcting positions of the first substrate and the second substrate; supplying gas having a temperature of about 50 to about 200° C. into the vacuum chamber; temporarily laminating the first substrate and the second substrate; venting the vacuum chamber; and bonding the first substrate and the second substrate. The panel is laminated after being filled with a heated gas and thus, when it is exposed to room temperature, the mobility of the gas decreases while reducing its initial inner pressure, thereby preventing panel failure.

Abstract: An attaching device and a method of fabricating an organic light emitting device using the same are disclosed. The attaching device includes a process chamber, first and second substrate supporters, a substrate detachable part, and an open-close valve. The first and second substrate supporters are positioned inside the process chamber, load and fix substrates. The substrate detachable part is positioned inside the second substrate supporter, and moves up and down to allow the second substrate supporter to instantaneously receive a physical pressure. The open-close valve is positioned on a portion of the process chamber, and opens and closes the process chamber to control a pressure inside the process chamber.

Abstract: Provided are an organic electro-luminescence display device and a method of manufacturing the same. The organic electro-luminescence display device includes a first substrate, a second substrate facing the first substrate and including an organic electro-luminescence diode, and a sealant interposed between the first substrate and the second substrate to seal the organic electro-luminescence diode from outside and attach the first substrate to the second substrate. Herein, the sealant is formed of a frit glass.

Abstract: A method for manufacturing light emitting devices is provided. The method may reduce the inner pressure of a laminated image emitting device panel, thereby preventing failure of the panel. The method includes holding a first substrate with a lower chuck located in a vacuum chamber; holding a second substrate with an upper chuck located opposite the first chuck in the vacuum chamber; creating a high vacuum in the vacuum chamber; correcting positions of the first substrate and the second substrate; supplying gas having a temperature of about 50 to about 200° C. into the vacuum chamber; temporarily laminating the first substrate and the second substrate; venting the vacuum chamber; and bonding the first substrate and the second substrate. The panel is laminated after being filled with a heated gas and thus, when it is exposed to room temperature, the mobility of the gas decreases while reducing its initial inner pressure, thereby preventing panel failure.

Abstract: An organic light emitting diode (OLED) device according to the present invention includes a first substrate; a first electrode on the first substrate in the pixel region, the first electrode formed of a metal; an organic light-emitting layer on the first electrode; a second electrode on the organic light-emitting layer, the second electrode formed of a transparent conductive material; and a transparent layer on the second electrode, the transparent layer including an inorganic material or a semiconductor material.

Abstract: An organic light emitting diode (OLED) device according to the present invention includes a first substrate; a first electrode on the first substrate in the pixel region, the first electrode formed of a metal; an organic light-emitting layer on the first electrode; a second electrode on the organic light-emitting layer, the second electrode formed of a transparent conductive material; and a transparent layer on the second electrode, the transparent layer including an inorganic material or a semiconductor material.