Patents by Inventor Choontaek SHIM

Choontaek SHIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Protective film for electronic device and window assembly using the same
    Patent number: 10882285
    Abstract: A protective film for an electronic device is introduced. The protective film may comprises a deformable outer layer formed with a synthetic resin; a deformable modified material layer attached with a lower surface of the deformable outer layer, wherein the deformable modified layer is configured to be hardened responsive to receipt of an external stimuli; a deformable inner layer formed with a synthetic resin, attached with a lower surface of the deformable modified material layer; and an adhesive layer adhering to a lower surface of the deformable inner layer. Further, various embodiments can be implemented according to the present disclosure.
    Type: Grant
    Filed: February 20, 2018
    Date of Patent: January 5, 2021
    Assignees: Samsung Electronics Co., Ltd., Daehyunst Co. Ltd.
    Inventors: Younggyun Kim, Choontaek Shim, Sangil Hwang, Jeeyoung Oh, Hoyoung Lee, Jaeseon Jeon, Jaehyeok Heo
  • PROTECTIVE FILM FOR ELECTRONIC DEVICE AND WINDOW ASSEMBLY USING THE SAME
    Publication number: 20180272669
    Abstract: A protective film for an electronic device is introduced. The protective film may comprises a deformable outer layer formed with a synthetic resin; a deformable modified material layer attached with a lower surface of the deformable outer layer, wherein the deformable modified layer is configured to be hardened responsive to receipt of an external stimuli; a deformable inner layer formed with a synthetic resin, attached with a lower surface of the deformable modified material layer; and an adhesive layer adhering to a lower surface of the deformable inner layer. Further, various embodiments can be implemented according to the present disclosure.
    Type: Application
    Filed: February 20, 2018
    Publication date: September 27, 2018
    Inventors: Younggyun KIM, Choontaek SHIM, Sangil HWANG, Jeeyoung OH, Hoyoung LEE, Jaeseon JEON, Jaehyeok HEO