Abstract: An electrical circuit has a printed circuit board which is lengthened at the side in the form of at least one longitudinal contact projection having at least one electrical conductor track and a solder point disposed at the end of the conductor track. Because of its mechanical flexibility, the contact projection allows flexible contact to be made with other electronic components, with little effort. An electrical circuit such as this is particularly highly suitable for electrical small appliances, in particular for a hearing aid.

Abstract: A substrate for an electronic component comprises a dielectric body having an upper surface including a plurality of inner contact pads and a lower surface including a plurality of outer contact pads. Each outer contact pad has an inner face and an outer face. An insulating layer covers the lower surface of the dielectric body and the peripheral regions of the plurality of outer contact pads. A depression is located in the approximate lateral centre of the outer face of each of the plurality of outer contact.

Abstract: The invention is to increase the degree of miniaturization, in particular of amplifier circuit boards of hearing aids. An SMD component and an electronic component of a circuit arrangement are to be electrically connected to each other by a wire bond connection. The circuit arrangement comprises a printed circuit board and an integrated circuit mounted on the printed circuit board. One or more further integrated circuits are disposed between the said integrated circuit and the printed circuit board. An SMD component is mounted directly on the integrated circuit. Alternatively, the SMD component is mounted directly on the printed circuit board and electrically connected to one of a stack of integrated circuits. The SMD component is electrically connected to the integrated circuit by means of bond wires. Space can be saved on the printed circuit board as a result of the stack wise arrangement.