Patents by Inventor Chorng-Tao Yu

Chorng-Tao Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5131752
    Abstract: Endpoint control of thickness of a film being deposited or etched is achieved by use of an ellipsometer that derives delta and psi coordinates of a polarized light beam reflected from the work piece during the course of processing. Measured film thickness is a function of the delta and psi coordinates and other parameters. Delta and psi coordinates of a selected end point (final film thickness) of the process are calculated, and an unbounded line through the endpoint perpendicular to the direction of a plot of delta and psi coordinates adjacent the endpoint is defined. As the processing continues, an ERROR is generated that becomes zero when measured delta and psi coordinates are on the line. When this error changes sign, in the appropriate cycle and within a reasonable range of the endpoint, the desired thickness has been attained, and the process is stopped. The improved film thickness endpoint control is used in a rapid thermal processing system wherein temperatures are changed at a rate of 100.degree. C.
    Type: Grant
    Filed: June 28, 1990
    Date of Patent: July 21, 1992
    Assignee: Tamarack Scientific Co., Inc.
    Inventors: Chorng-Tao Yu, Kenneth H. Isaak
  • Patent number: 4886954
    Abstract: A diffusion furnace and method for processing semiconductor wafers standing on edge wherein the furnace has vertically adjacent electrical resistance heating elements wired in parallel and disposed above the wafers. This arrangement enables the heat input to the furnace by the heating elements to be varied. In a preferred embodiment, the heating elements in the upper section of the tube are connected in one circuit and the heating elements in the lower section of the tube are connected in a second circuit and each circuit is controlled in response to the temperature in that section.
    Type: Grant
    Filed: April 15, 1988
    Date of Patent: December 12, 1989
    Assignee: Thermco Systems, Inc.
    Inventors: Chorng-Tao Yu, Michael A. Fisk, Alan Emami
  • Patent number: 4711989
    Abstract: There is a substantial heat loss and drop in temperature in a hot-wall diffusion tube when a batch of wafers at room temperature is loaded into the tube. The temperature of the atmosphere in a zone in the tube is quickly recovered by sensing both the temperature of the tube atmosphere and the temperature of a heating element surrounding the zone with thermocouples, mixing the signals of the thermocouples to produce a ratio average signal and then controlling the heat input to the heating elements in response to the ratio average of the sensed temperature.
    Type: Grant
    Filed: May 19, 1986
    Date of Patent: December 8, 1987
    Assignee: Thermco Systems, Inc.
    Inventor: Chorng-Tao Yu