Patents by Inventor Chorng-Tyan Lin
Chorng-Tyan Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9874807Abstract: An optical image capturing module and an alignment method and an observation method for an upper substrate and a lower substrate using the optical image capturing module are provided. The upper substrate and the lower substrate are disposed opposite. The alignment method includes the following steps of: emitting a light ray; filtering the light ray and dividing the light ray into a light ray at first wavelength and a light ray at second wavelength, whereby the light ray at first wavelength irradiates a pattern on the upper substrate, and the light ray at second wavelength irradiates a pattern on the lower substrate; reflecting the pattern on the upper substrate to an image capturing device; reflecting the pattern on the lower substrate to the image capturing device; and determining the positions of the pattern on the upper substrate and the pattern on the lower substrate on the image capturing device.Type: GrantFiled: December 3, 2013Date of Patent: January 23, 2018Assignee: METAL INDUSTRIES RESEARCH&DEVELOPMENT CENTREInventors: Shi-Wei Lin, Chun-Ming Yang, Chih-Chin Wen, Chorng-Tyan Lin
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Patent number: 9459460Abstract: A method of aligning an upper substrate and a lower substrate is provided. The upper and lower substrates are oppositely arranged, and the aligning method includes the following steps: providing an optical image capturing module; emitting light rays to a third surface of a first prism; filtering the light rays, so that the light rays are divided into light rays at the first wavelength range and light rays at the second wavelength range, wherein the light rays at the first wavelength range irradiate a pattern on the upper substrate, and light rays at the second wavelength range irradiate a pattern on the lower substrate; reflecting a pattern image on the upper substrate to an image capturing apparatus; reflecting a pattern image on the lower substrate to the image capturing apparatus; and determining locations of the patterns of the upper and lower substrate that are on the image capturing apparatus.Type: GrantFiled: August 8, 2014Date of Patent: October 4, 2016Assignee: METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTREInventors: Shi-Wei Lin, Chun-Ming Yang, Chih-Chin Wen, Chorng-Tyan Lin
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Patent number: 9387664Abstract: A slit-type scraper device includes: a body, a first scraper portion, a cover, a second scraper portion, an air pressure through hole and a side cover unit. The body includes a groove and a slit portion abutting against the groove. The first scraper portion is abutting against the slit portion. The cover includes a plate portion. The second scraper portion is abutting against the plate portion, wherein the position of the second scraper portion is corresponding to the first scraper portion. The air pressure through hole is disposed on the body, in communication with the groove, and adapted to connect an air pressure connection member to input air pressure. The side cover unit is adapted to form an ink storage space between the plate portion and the groove, and form an ink output slit between the slit portion and the plate portion.Type: GrantFiled: December 1, 2015Date of Patent: July 12, 2016Assignee: Metal Industries Research & Development CentreInventors: Kuan-Chih Liu, Chorng-Tyan Lin, Ho-Chung Fu
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Publication number: 20160159073Abstract: A slit-type scraper device includes: a body, a first scraper portion, a cover, a second scraper portion, an air pressure through hole and a side cover unit. The body includes a groove and a slit portion abutting against the groove. The first scraper portion is abutting against the slit portion. The cover includes a plate portion. The second scraper portion is abutting against the plate portion, wherein the position of the second scraper portion is corresponding to the first scraper portion. The air pressure through hole is disposed on the body, in communication with the groove, and adapted to connect an air pressure connection member to input air pressure. The side cover unit is adapted to form an ink storage space between the plate portion and the groove, and form an ink output slit between the slit portion and the plate portion.Type: ApplicationFiled: December 1, 2015Publication date: June 9, 2016Inventors: Kuan-Chih LIU, Chorng-Tyan LIN, Ho-Chung FU
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Patent number: 9362153Abstract: A method for aligning substrates in different spaces and having different sizes includes: capturing actual local images of two substrates; comparing specific marks in standard local feature regions of the two substrates, and obtaining specific marks in actual local feature regions of the two substrates; separately establishing actual coordinate systems of the two substrates to synthesize aligned assembly coordinate system; comparing coordinate values of the specific marks of the two substrates in the two actual coordinate systems to obtain first group of offsets, and comparing sizes of the two substrates to obtain a size difference; using the first group of offsets and the size difference to correct coordinate values of specific marks of one of the two substrates; comparing coordinate values of the specific marks of the two substrates, to obtain second group of offsets; and moving the one to a position compensated by the second group of offsets.Type: GrantFiled: January 23, 2014Date of Patent: June 7, 2016Assignee: METAL INDUSTRIES RESEARCH&DEVELOPMENT CENTREInventors: Chorng-Tyan Lin, Chih-Chin Wen, Chun-Ming Yang, Shi-Wei Lin
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Publication number: 20150205216Abstract: A method for aligning substrates in different spaces and having different sizes includes: capturing actual local images of two substrates; comparing specific marks in standard local feature regions of the two substrates, and obtaining specific marks in actual local feature regions of the two substrates; separately establishing actual coordinate systems of the two substrates to synthesize aligned assembly coordinate system; comparing coordinate values of the specific marks of the two substrates in the two actual coordinate systems to obtain first group of offsets, and comparing sizes of the two substrates to obtain a size difference; using the first group of offsets and the size difference to correct coordinate values of specific marks of one of the two substrates; comparing coordinate values of the specific marks of the two substrates, to obtain second group of offsets; and moving the one to a position compensated by the second group of offsets.Type: ApplicationFiled: January 23, 2014Publication date: July 23, 2015Applicant: METAL INDUSTRIES RESEARCH&DEVELOPMENT CENTREInventors: CHORNG-TYAN LIN, CHIH-CHIN WEN, CHUN-MING YANG, SHI-WEI LIN
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Publication number: 20150049334Abstract: A method of aligning an upper substrate and a lower substrate is provided. The upper and lower substrates are oppositely arranged, and the aligning method includes the following steps: providing an optical image capturing module; emitting light rays to a third surface of a first prism; filtering the light rays, so that the light rays are divided into light rays at the first wavelength range and light rays at the second wavelength range, wherein the light rays at the first wavelength range irradiate a pattern on the upper substrate, and light rays at the second wavelength range irradiate a pattern on the lower substrate; reflecting a pattern image on the upper substrate to an image capturing apparatus; reflecting a pattern image on the lower substrate to the image capturing apparatus; and determining locations of the patterns of the upper and lower substrate that are on the image capturing apparatus.Type: ApplicationFiled: August 8, 2014Publication date: February 19, 2015Inventors: SHI-WEI LIN, CHUN-MING YANG, CHIH-CHIN WEN, CHORNG-TYAN LIN
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Patent number: 8854450Abstract: An alignment method for assembling substrates in different spaces without fiducial mark and its system are provided, and the alignment method has steps of: pre-defining partially standard character regions of two substrates; capturing at least two partially actual images of two substrates in different waiting spaces, respectively; comparing to obtain at least two partially actual character regions of the two substrates, respectively; building actual coordinate systems of the two substrates, respectively; comparing the actual coordinate systems of the two substrates with each other to obtain a set of offset values; moving the two substrates from the different waiting spaces to an alignment-and-installation space based on the set of offset values and a predetermined movement value, respectively; and stacking the two substrates with each other to finish the alignment and installation in the alignment-and-installation space.Type: GrantFiled: January 17, 2012Date of Patent: October 7, 2014Assignee: Metal Industries Research & Development CentreInventors: Chorng-tyan Lin, Chih-chin Wen, Chun-ming Yang, Jwu-jiun Yang
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Publication number: 20140184791Abstract: An optical image capturing module and an alignment method and an observation method for an upper substrate and a lower substrate using the optical image capturing module are provided. The upper substrate and the lower substrate are disposed opposite. The alignment method includes the following steps of: emitting a light ray; filtering the light ray and dividing the light ray into a light ray at first wavelength and a light ray at second wavelength, whereby the light ray at first wavelength irradiates a pattern on the upper substrate, and the light ray at second wavelength irradiates a pattern on the lower substrate; reflecting the pattern on the upper substrate to an image capturing device; reflecting the pattern on the lower substrate to the image capturing device; and determining the positions of the pattern on the upper substrate and the pattern on the lower substrate on the image capturing device.Type: ApplicationFiled: December 3, 2013Publication date: July 3, 2014Applicant: METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTREInventors: SHI-WEI LIN, CHUN-MING YANG, CHIH-CHIN WEN, CHORNG-TYAN LIN
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Patent number: 8720812Abstract: A winding apparatus providing steady tension includes: a loading unit rotatably supporting a roll of a sheet, releasing the sheet, and outputting an angle signal and a torque signal; a winding unit adapted to collect the sheet into a roll form; a dancer roller and a tension sensing unit separately arranged between the loading unit and the winding unit and outputting a shift signal and a tension signal respectively; and a control module having a calculating unit and a command unit. The calculating unit electrically connects with the loading unit, the dancer roller and the tension sensing unit to receive the signals and generates a torque command signal. The command unit electrically connects with the calculating unit and the loading unit to receive the torque command signal and produces a control signal by the torque command signal or a velocity signal.Type: GrantFiled: October 4, 2011Date of Patent: May 13, 2014Assignee: Metal Industries Research & Development CentreInventors: Kuan-Chih Liu, Chorng-Tyan Lin
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Patent number: 8644591Abstract: An alignment method for assembling substrates without fiducial mark is provided and has steps of: pre-defining at least two partially standard character regions; capturing at least two partially actual images of a first substrate; comparing to obtain at least two partially actual character regions; building an actual coordinate system of the first substrate; comparing the actual coordinate system with a coordinate system of a second substrate to obtain three types of offset values; moving the first substrate to a correct waiting position based on the offset values; ensuring if the first substrate is disposed at the correct waiting position; and stacking the first substrate with the second substrate to finish the alignment and installation. Thus, the alignment method of the present invention can be applied to to-be-installed substrates without any fiducial mark for alignment.Type: GrantFiled: January 17, 2012Date of Patent: February 4, 2014Assignee: Metal Industries Research & Development CentreInventors: Chorng-tyan Lin, Chih-chin Wen, Chun-ming Yang, Jwu-jiun Yang
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Publication number: 20130147942Abstract: An alignment method for assembling substrates in different spaces without fiducial mark and its system are provided, and the alignment method has steps of: pre-defining partially standard character regions of two substrates; capturing at least two partially actual images of two substrates in different waiting spaces, respectively; comparing to obtain at least two partially actual character regions of the two substrates, respectively; building actual coordinate systems of the two substrates, respectively; comparing the actual coordinate systems of the two substrates with each other to obtain a set of offset values; moving the two substrates from the different waiting spaces to an alignment-and-installation space based on the set of offset values and a predetermined movement value, respectively; and stacking the two substrates with each other to finish the alignment and installation in the alignment-and-installation space.Type: ApplicationFiled: January 17, 2012Publication date: June 13, 2013Applicant: Metal Industries Research & Development CentreInventors: CHORNG-TYAN LIN, Chih-chin Wen, Chun-ming Yang, Jwu-jiun Yang
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Publication number: 20130148878Abstract: An alignment method for assembling substrates without fiducial mark is provided and has steps of: pre-defining at least two partially standard character regions; capturing at least two partially actual images of a first substrate; comparing to obtain at least two partially actual character regions; building an actual coordinate system of the first substrate; comparing the actual coordinate system with a coordinate system of a second substrate to obtain three types of offset values; moving the first substrate to a correct waiting position based on the offset values; ensuring if the first substrate is disposed at the correct waiting position; and stacking the first substrate with the second substrate to finish the alignment and installation. Thus, the alignment method of the present invention can be applied to to-be-installed substrates without any fiducial mark for alignment.Type: ApplicationFiled: January 17, 2012Publication date: June 13, 2013Applicant: Metal Industries Research & Development CentreInventors: Chorng-tyan Lin, Chih-Chin Wen, Chun-ming Yang, Jwu-jiun Yang
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Publication number: 20120138726Abstract: A winding apparatus providing steady tension is proposed, which comprises: a loading unit rotatably supporting a roll of a sheet, releasing the sheet, and outputting an angle signal and a torque signal; a winding unit adapted to collect the sheet into a roll form; a dancer roller and a tension sensing unit separately arranged between the loading unit and the winding unit and outputting a shift signal and a tension signal respectively; and a control module having a calculating unit and a command unit, wherein the calculating unit electrically connects with the loading unit, the dancer roller and the tension sensing unit to receive the said signals and generating a torque command signal, and the command unit electrically connects with the calculating unit and the loading unit to receive the torque command signal and produces a control signal by the torque command signal or a velocity signal.Type: ApplicationFiled: October 4, 2011Publication date: June 7, 2012Inventors: Kuan-Chih Liu, Chorng-Tyan Lin