Patents by Inventor CHORONG JEONG

CHORONG JEONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PFA molded body with excellent blister resistance and method of controlling occurrence of blisters in PFA molded body
    Patent number: 11267209
    Abstract: Provided is a molded body with a hollow portion comprising tetrafluoroethylene and perfluoro(alkyl vinyl ether) copolymer, which is obtained by heat treating a molded body with a hollow portion obtained by melt molding tetrafluoroethylene and perfluoro(alkyl vinyl ether) copolymer having a melt flow rate of 0.1 to 100 g/10 min when measured with a load of 5 kg and a measurement temperature of 372±0.1° C. in accordance with ASTM D1238. The heat treatment is carried out at a temperature from 130° C. below the melting point of the copolymer to the melting point of the copolymer. The molded body exhibits excellent blister resistance when utilized in contact with harsh chemicals and under harsh operating conditions.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: March 8, 2022
    Assignee: CHEMOURS-MITSUI FLUOROPRODUCTS CO., LTD.
    Inventors: Takahiro Nishimura, Hitomi Nishimura, Chorong Jeong
  • PFA MOLDED BODY WITH EXCELLENT BLISTER RESISTANCE AND METHOD OF CONTROLLING OCCURRENCE OF BLISTERS IN PFA MOLDED BODY
    Publication number: 20170361548
    Abstract: Provided is a molded body with a hollow portion comprising tetrafluoroethylene and perfluoro(alkyl vinyl ether) copolymer, which is obtained by heat treating a molded body with a hollow portion obtained by melt molding tetrafluoroethylene and perfluoro(alkyl vinyl ether) copolymer having a melt flow rate of 0.1 to 100 g/10 min when measured with a load of 5 kg and a measurement temperature of 372±0.1° C. in accordance with ASTM D1238. The heat treatment is carried out at a temperature from 130° C. below the melting point of the copolymer to the melting point of the copolymer. The molded body exhibits excellent blister resistance when utilized in contact with harsh chemicals and under harsh operating conditions.
    Type: Application
    Filed: December 18, 2015
    Publication date: December 21, 2017
    Applicant: Dupont-Mitsui Fluorochemicals Co., Ltd.
    Inventors: TAKAHIRO NISHIMURA, HITOMI NISHIMURA, CHORONG JEONG