Patents by Inventor Chou-Chin Weng

Chou-Chin Weng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate packaging structure and packaging method thereof
    Patent number: 10058955
    Abstract: A substrate packaging structure includes an upper substrate, a lower substrate, a frit disposed there between for adhering the upper substrate and the lower substrate, and a light-diffusing component. The light-diffusing component is disposed on the upper substrate and corresponding to the frit. The light-diffusing component is utilized for diffusing a laser beam.
    Type: Grant
    Filed: July 7, 2014
    Date of Patent: August 28, 2018
    Assignee: AU OPTRONICS CORPORATION
    Inventors: Chih-Hung Hsiao, Wei-Chih Chang, Chou-Chin Weng
  • SUBSTRATE PACKAGING STRUCTURE AND PACKAGING METHOD THEREOF
    Publication number: 20150202715
    Abstract: A substrate packaging structure includes an upper substrate, a lower substrate, a frit disposed there between for adhering the upper substrate and the lower substrate, and a light-diffusing component. The light-diffusing component is disposed on the upper substrate and corresponding to the frit. The light-diffusing component is utilized for diffusing a laser beam.
    Type: Application
    Filed: July 7, 2014
    Publication date: July 23, 2015
    Inventors: Chih-Hung HSIAO, Wei-Chih CHANG, Chou-Chin WENG
  • Fabricating method of light emitting device and forming method of organic layer
    Patent number: 8703529
    Abstract: A fabricating method of a light emitting device is provided. In the fabricating method, a substrate having a first electrode layer is provided. An organic film solution that includes an organic material, a solid medium, and a solvent is provided. The solid medium is capable of sublimation, and the organic material and the solid medium are mixed into the solvent. An organic film is formed on the first electrode layer by using the organic film solution. The solvent and the solid medium are removed to form an organic functional layer that has the organic material. A second electrode layer is formed on the organic functional layer.
    Type: Grant
    Filed: March 16, 2012
    Date of Patent: April 22, 2014
    Assignee: Au Optronics Corporation
    Inventors: Eng-Jay Chen, Chou-Chin Weng
  • FABRICATING METHOD OF LIGHT EMITTING DEVICE AND FORMING METHOD OF ORGANIC LAYER
    Publication number: 20130130422
    Abstract: A fabricating method of a light emitting device is provided. In the fabricating method, a substrate having a first electrode layer is provided. An organic film solution that includes an organic material, a solid medium, and a solvent is provided. The solid medium is capable of sublimation, and the organic material and the solid medium are mixed into the solvent. An organic film is formed on the first electrode layer by using the organic film solution. The solvent and the solid medium are removed to form an organic functional layer that has the organic material. A second electrode layer is formed on the organic functional layer.
    Type: Application
    Filed: March 16, 2012
    Publication date: May 23, 2013
    Applicant: AU OPTRONICS CORPORATION
    Inventors: Eng-Jay Chen, Chou-Chin Weng