Patents by Inventor Chou-Hsiung CHUANG

Chou-Hsiung CHUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Housing assembly and electronic device
    Patent number: 10602641
    Abstract: A housing assembly has an insertion opening adapted for insertion of an electronic unit and includes a first housing, a second housing, a thermal pad, and a guide structure. The second housing is opposite to the first housing, a space is formed between the first housing and the second housing, and the space is in communication with the insertion opening. The thermal pad is disposed on one side of the first housing facing the second housing. The guide structure is disposed inside the space and is adapted to guide the electronic unit to move towards the first housing when the electronic unit is inserted into the space through the insertion opening and moves, so that the electronic unit comes into contact with the thermal pad.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: March 24, 2020
    Assignee: PEGATRON CORPORATION
    Inventors: Kai-Ming Chang, Chou-Hsiung Chuang, Chun-Tang Hsu, Yu-Juei Chang
  • HOUSING ASSEMBLY AND ELECTRONIC DEVICE
    Publication number: 20190335611
    Abstract: A housing assembly has an insertion opening adapted for insertion of an electronic unit and includes a first housing, a second housing, a thermal pad, and a guide structure. The second housing is opposite to the first housing, a space is formed between the first housing and the second housing, and the space is in communication with the insertion opening. The thermal pad is disposed on one side of the first housing facing the second housing. The guide structure is disposed inside the space and is adapted to guide the electronic unit to move towards the first housing when the electronic unit is inserted into the space through the insertion opening and moves, so that the electronic unit comes into contact with the thermal pad.
    Type: Application
    Filed: February 25, 2019
    Publication date: October 31, 2019
    Inventors: Kai-Ming CHANG, Chou-Hsiung CHUANG, Chun-Tang HSU, Yu-Juei CHANG