Abstract: An apparatus and method is provided for detaching a semiconductor chip from an adhesive tape on which it is mounted. The apparatus comprises a platform adapted to contact the adhesive tape at a position of the chip and a retaining force generator coupled to the platform for drawing the adhesive tape in a direction away from the chip. An elevation device is projectable from the platform that is movable both laterally across a surface of the platform and vertically with respect to the platform for elevating the chip. By moving the elevation device across a width of the chip while lifting the chip, controlled lifting of the chip and propagation of delamination between the chip and the adhesive tape may be achieved.

Abstract: A tunable vibration absorption device is provided that is suitable for active or semi-active vibration absorption or damping of vibrations in vibrating structures. It comprises a stack including a force actuator mechanism for generating an axial actuation force and a force sensor mechanism which is responsive to an external force acting on the stack to generate a force signal. A controller unit is electrically connected to the force sensor mechanism for receiving the force signal generated by the force sensor mechanism, and it is also electrically connected to the force actuator mechanism for adjusting the axial actuation force generated by the force actuator mechanism in response to the received force signal generated by the force sensor mechanism.

Abstract: A piezoelectric device is provided that comprises a mechanical amplifier adapted to produce a displacement output and/or receive a force input, and first and second flexible platforms connected to the mechanical amplifier. The first flexible platform is connected to one side of the mechanical amplifier and piezoelectric material is mounted on the first flexible platform for controllably flexing the first flexible platform. The second flexible platform is connected to another side of the mechanical amplifier and piezoelectric material is mounted to the second flexible platform for controllably flexing the second flexible platform.

Abstract: A transducer for a wire bonding apparatus is formed of two separate parts sandwiching therebetween a plurality of piezoelectric elements. One of the two parts is the amplifying horn, and by selecting appropriate sizes and shapes for the two parts, vibrational energy can be concentrated at the distal end of the amplifying horn where the bonding tool is located.

Abstract: A pick and place apparatus comprises a bond arm adapted for rotation about an axis between a pick location and a place location. The bond arm is formed with a cavity at an end of the arm remote from the axis, within which cavity are located a plurality of damping particles for damping unwanted vibrations of the bond arm. The particles may be irregular tungsten granules with a diameter between 0.3 and 1.2 mm and a filling ratio of about 75%.

Abstract: A transducer for a wire bonding apparatus is formed of two separate parts sandwiching therebetween a plurality of piezoelectric elements. One of the two parts is the amplifying horn, and by selecting appropriate sizes and shapes for the two parts, vibrational energy can be concentrated at the distal end of the amplifying horn where the bonding tool is located.

Abstract: A transducer for a wire bonding apparatus is formed of two separate parts sandwiching therebetween a plurality of piezoelectric elements. One of the two parts is the amplifying horn, and by selecting appropriate sizes and shapes for the two parts, vibrational energy can be concentrated at the distal end of the amplifying horn where the bonding tool is located.

Abstract: A pick and place apparatus comprises a bond arm adapted for rotation about an axis between a pick location and a place location. The bond arm is formed with a cavity at an end of the arm remote from the axis, within which cavity are located a plurality of damping particles for damping unwanted vibrations of the bond arm. The particles may be irregular tungsten granules with a diameter between 0.3 and 1.2 mm and a filling ratio of about 75%.