Patents by Inventor Chou L. Chen

Chou L. Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5472354
    Abstract: A two piece type electrical connector is provided which is matingly connect together boards in a designated correct polarity relation. A pair of first latch members L-shaped in cross-section are projected one at each end of a mother board-side housing and each have a ridge-like friction latch. A pair of second latch members L-shaped in cross-section are projected one at each end of a daughter board-side housing. One surface side of the second latch member has a projection inserted into the guide groove. One section of the projection has a recess-like friction latch frictionally engageable with the ridge-like friction latch.
    Type: Grant
    Filed: March 17, 1995
    Date of Patent: December 5, 1995
    Inventors: Chou L. Chen, Kow C. Lee
  • Patent number: 5454726
    Abstract: A pair of plug-side engagement members are mounted one at each end of a plug connector attached to a mother board. A pair of receptacle-side elastic members are provided on a daughter board attached to a receptacle connector, os that the receptacle-side elastic members correspond to the plug-side engagement members. With the plug-side engagement members connected to the receptacle-side members, the former is elastically engaged to the latter so that a mechanical insertion force is exerted on the plug-side and receptacle-side connectors to force the plug and receptacle together.
    Type: Grant
    Filed: January 31, 1995
    Date of Patent: October 3, 1995
    Assignee: Berg Technology, Inc.
    Inventors: Kow C. Lee, Chou L. Chen, Bo W. Wang
  • Patent number: 5386087
    Abstract: A circuit pattern layer is formed over the surface of a laminated board such that it includes one array of solder pads. The circuit pattern layer has its surface covered with a solder mask layer. The solder mask layer has a U-shaped recess at the area of the solder pad. The solder pad is exposed at the area of the U-shaped recess. Upon the soldering of the connector's connection terminal to the solder pad at the area of the U-shaped recess, a molten solder is kept in the U-shaped recess and prevented from flowing onto the adjacent connection terminal. It is thus possible to prevent a solder bridge from being created across those connection terminals.
    Type: Grant
    Filed: February 16, 1993
    Date of Patent: January 31, 1995
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Chen W. Lee, Fong P. Chang, Chou L. Chen