Abstract: A heating carrier device for use on a sputtering cathode assembly has a heating carrier for heating a sputtering target to control a sputtering target temperature; a magnetic component for generating a magnetic field; a thermal insulation component disposed between the heating carrier and the magnetic component; and a cooling system for cooling the magnetic component. Therefore, the heating carrier device reduces the bonding strength of the sputtering target, reduces the particle size of sputtering products, and grows high-quality, uniform thin films.