Abstract: A workpiece is unloaded from a wafer-receiving container. A first discriminating sensor detects a front surface of the workpiece, and determines either a semiconductor wafer or a spacer is the workpiece. Where the workpiece is a wafer, the first discriminating sensor also determines whether or not a protective tape is on the front surface of the workpiece. Where it is determined that a protective tape is not on the front surface, a second discriminating sensor detects a back surface of the wafer for discriminating the presence or absence of the protective tape.

Abstract: A first holding table suction-holds an annular projection of a wafer remaining on a rear face thereof for surrounding a back grinding region. A second holding table having an outer peripheral wall adjacent to an inner wall of the annular projection is inserted into a flat portion inside the annular projection for joining a separating adhesive tape to a protective tape on a surface of the wafer while a flat plane of the flat portion is suction-held. Thereafter, the adhesive tape is separated. Accordingly, the adhesive tape is separated from the surface of the wafer together with the protective tape.

Abstract: A workpiece is unloaded from a wafer-receiving container. A first discriminating sensor detects a front surface of the workpiece, and determines either a semiconductor wafer or a spacer is the workpiece. Where the workpiece is a wafer, the first discriminating sensor also determines whether or not a protective tape is on the front surface of the workpiece. Where it is determined that a protective tape is not on the front surface, a second discriminating sensor detects a back surface of the wafer for discriminating the presence or absence of the protective tape.

Abstract: A first holding table suction-holds an annular projection of a wafer remaining on a rear face thereof for surrounding a back grinding region. A second holding table having an outer peripheral wall adjacent to an inner wall of the annular projection is inserted into a flat portion inside the annular projection for joining a separating adhesive tape to a protective tape on a surface of the wafer while a flat plane of the flat portion is suction-held. Thereafter, the adhesive tape is separated. Accordingly, the adhesive tape is separated from the surface of the wafer together with the protective tape.

Abstract: A frame transport unit places a ring frame on a frame holding section of a holding table, and a holding arm suspendingly holds a protection sheet to place it on a wafer holding table. The holding arm suction-holds a wafer to place it on the protection sheet such that a circuit surface of the wafer is directed downward. An adhesive tape is joined to the wafer and the ring frame suction-held via the protection sheet.

Abstract: Two or more pads having through holes formed therein concentrically at given pitches are provided on a U-shaped holding arm. Compressed air is sprayed from the pad to a protection sheet to generate negative pressure between a holding surface of the holding arm and the protection sheet for suspendingly holding a wafer with the protection sheet floating, or the pad suction-holds and transports a rear face of the wafer having an exposed circuit surface.

Abstract: Upper and lower housings nip a supporting adhesive tape that is exposed between an outer periphery of a wafer and a ring frame, thereby forming a chamber. Here, the adhesive tape having a larger width than a diameter of the ring frame divides the chamber into the upper and lower housings to form two spaces. Pressure difference occurs between both spaces such that the lower housing has a reduced pressure than the upper housing for joining the adhesive tape to the wafer.

Abstract: A receiver base receives from below a front end portion of a label that is fed forward from a folded-back portion of an release paper and droops forward, so that the label is held in a predetermined forwardly and downwardly inclined posture. In a process of separating and feeding the label in such a state where part of a rear end of the label is joined and held onto the release paper, a suction head having a downward suction surface that is inclined forward and downward is brought closer to a top surface of the label being separated so as to suck the label.

Abstract: A wafer holding table that suction-holds a wafer of a mount frame moves downward below a frame holding table when a joining roller passes over an exposed portion of an adhesive tape between the wafer W and the ring frame f. Here, the exposed portion of the adhesive tape inclines obliquely downward, thereby joining the adhesive tape to the mount frame.

Abstract: A protective tape is supplied above the surface of a semiconductor wafer, and joined to the surface of the semiconductor wafer by rolling a joining roller while pressing the joining roller against the protective tape. Then the joined protective tape is cut out along the outer periphery of the semiconductor wafer. Subsequently, the protective tape is pressed with the pressure member to flatten the surface of the protective tape.

Abstract: A receiver base receives from below a front end portion of a label that is fed forward from a folded-back portion of an release paper and droops forward, so that the label is held in a predetermined forwardly and downwardly inclined posture. In a process of separating and feeding the label in such a statewhere part of a rear end of the label is joined and held onto the release paper, a suction head having a downward suction surface that is inclined forward and downward is brought closer to a top surface of the label being separated so as to suck the label.