Patents by Inventor Choukri Karoui

Choukri Karoui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6819535
    Abstract: A device of protection of at least one circuit supplied by a voltage obtained from at least one inductive element, including a switch for short-circuiting the supply provided by the inductive element, and circuitry for turning on the switch when the supply voltage exceeds a predetermined threshold and for turning it off when it is smaller than the threshold.
    Type: Grant
    Filed: November 13, 2002
    Date of Patent: November 16, 2004
    Assignee: STMicroelectronics S.A.
    Inventors: Philippe Merceron, Choukri Karoui
  • Patent number: 6788168
    Abstract: A filter is formed as an integrated circuit by resistive and capacitive elements and includes, for connection to ground, at least two separate pads of a chip designed to be connected individually to at least two separate terminals of a package.
    Type: Grant
    Filed: July 29, 2002
    Date of Patent: September 7, 2004
    Assignee: STMicroelectronics S.A.
    Inventors: Fabrice Guitton, Choukri Karoui
  • Publication number: 20030090919
    Abstract: A device of protection of at least one circuit supplied by a voltage obtained from at least one inductive element, including a switch for short-circuiting the supply provided by the inductive element, and circuitry for turning on the switch when the supply voltage exceeds a predetermined threshold and for turning it off when it is smaller than the threshold.
    Type: Application
    Filed: November 13, 2002
    Publication date: May 15, 2003
    Inventors: Philippe Merceron, Choukri Karoui
  • Publication number: 20030001693
    Abstract: The invention concerns a filter produced in integrated circuit by means of resistive (R) and capacitive (C11, C12, C13, C14, C21, C22, C23, C24) elements and comprising, for ground connection, at least two separate bond pads (61-68) of a chip (69) not directly connected between them and designed to be connected individually to at least two separate terminals (71-78) of a housing (70).
    Type: Application
    Filed: July 29, 2002
    Publication date: January 2, 2003
    Inventors: Fabrice Guitton, Choukri Karoui