Patents by Inventor Chow Lap Keung

Chow Lap Keung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing an integrated circuit package
    Patent number: 6790710
    Abstract: In one aspect, the present invention features a method of manufacturing an integrated circuit package including providing a substrate having a first surface, a second surface opposite the first surface, a cavity through the substrate between the first and second surfaces and a conductive via extending through the substrate and electrically connecting the first surface of the substrate with the second surface of the substrate, applying a strip to the second surface of the substrate, mounting a semiconductor die on the strip, at least a portion of the semiconductor die being disposed inside the cavity, encapsulating in a molding material at least a portion of the first surface of the substrate, and removing the strip from the substrate.
    Type: Grant
    Filed: January 31, 2002
    Date of Patent: September 14, 2004
    Assignee: ASAT Limited
    Inventors: Neil Robert McLellan, Chun Ho Fan, Edward G. Combs, Tsang Kwok Cheung, Chow Lap Keung, Sadak Thamby Labeeb
  • Encapsulated integrated circuit package and method of manufacturing an integrated circuit package
    Publication number: 20030143781
    Abstract: In one aspect, the present invention features a method of manufacturing an integrated circuit package including providing a substrate having a first surface, a second surface opposite the first surface, a cavity through the substrate between the first and second surfaces and a conductive via extending through the substrate and electrically connecting the first surface of the substrate with the second surface of the substrate, applying a strip to the second surface of the substrate, mounting a semiconductor die on the strip, at least a portion of the semiconductor die being disposed inside the cavity, encapsulating in a molding material at least a portion of the first surface of the substrate, and removing the strip from the substrate.
    Type: Application
    Filed: January 31, 2002
    Publication date: July 31, 2003
    Inventors: Neil Robert McLellan, Chun Ho Fan, Edward G. Combs, Tsang Kwok Cheung, Chow Lap Keung, Sadak Thamby Labeeb