Patents by Inventor Chrirag S. Patel

Chrirag S. Patel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Silicon carrier optoelectronic packaging
    Patent number: 8559474
    Abstract: An optoelectronic (OE) package or system and method for fabrication is disclosed which includes a silicon layer with wiring. The silicon layer has an optical via for allowing light to pass therethrough. An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via. A plurality of OE elements are coupled to the silicon layer and electrically communicating with the wiring. At least one of the OE elements positioned in optical alignment with the optical via for receiving the light. A carrier is interposed between electrical interconnect elements. The carrier is positioned between the wiring of the silicon layer and a circuit board and the carrier is electrically connecting first interconnect elements connected to the wiring of the silicon layer and second interconnect elements connected to the circuit board.
    Type: Grant
    Filed: September 5, 2012
    Date of Patent: October 15, 2013
    Assignee: International Business Machines Corporation
    Inventors: Paul S. Andry, Russell A. Budd, Bing Dang, David Danovitch, Benjamin V. Fasano, Paul Fortier, Luc Guerin, Frank F. Libsch, Sylvain Ouimet, Chrirag S. Patel
  • SILICON CARRIER OPTOELECTRONIC PACKAGING
    Publication number: 20120326290
    Abstract: An optoelectronic (OE) package or system and method for fabrication is disclosed which includes a silicon layer with wiring. The silicon layer has an optical via for allowing light to pass therethrough. An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via. A plurality of OE elements are coupled to the silicon layer and electrically communicating with the wiring. At least one of the OE elements positioned in optical alignment with the optical via for receiving the light. A carrier is interposed between electrical interconnect elements. The carrier is positioned between the wiring of the silicon layer and a circuit board and the carrier is electrically connecting first interconnect elements connected to the wiring of the silicon layer and second interconnect elements connected to the circuit board.
    Type: Application
    Filed: September 5, 2012
    Publication date: December 27, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Paul S. Andry, Russell A. Budd, Bing Dang, David Danovitch, Benjamin V. Fasano, Paul Fortier, Luc Guerin, Frank R. Libsch, Sylvain Ouimet, Chrirag S. Patel