Abstract: An antenna transceiver architecture for a modular metasurface antenna and method for using the same are disclosed. In some embodiments, the antenna architecture includes a plurality of metasurface antenna tiles, where each metasurface antenna tile of the plurality of metasurface antenna tiles having one or more feed ports individually fed when in operation to support one or more independent beams, and wherein the plurality of metasurface antenna tiles comprise a plurality of sub-arrays of metasurface antenna tiles.

Abstract: A semiconductor structure comprises a top metal layer, a bond pad formed on the top metal layer, a conductor formed below the top metal layer, and an insulation layer separating the conductor from the top metal layer. The top metal layer includes a sub-layer of relatively stiff material compared to the remaining portion of the top metal layer. The sub-layer of relatively stiff material is configured to distribute stresses over the insulation layer to reduce cracking in the insulation layer.

Abstract: A semiconductor structure comprises a top metal layer, a bond pad formed on the top metal layer, a conductor formed below the top metal layer, and an insulation layer separating the conductor from the top metal layer. The top metal layer includes a sub-layer of relatively stiff material compared to the remaining portion of the top metal layer. The sub-layer of relatively stiff material is configured to distribute stresses over the insulation layer to reduce cracking in the insulation layer.

Abstract: A semiconductor structure comprises a top metal layer, a bond pad formed on the top metal layer, a conductor formed below the top metal layer, and an insulation layer separating the conductor from the top metal layer. The top metal layer includes a sub-layer of relatively stiff material compared to the remaining portion of the top metal layer. The sub-layer of relatively stiff material is configured to distribute stresses over the insulation layer to reduce cracking in the insulation layer.

Abstract: A semiconductor structure comprises a top metal layer, a bond pad formed on the top metal layer, a conductor formed below the top metal layer, and an insulation layer separating the conductor from the top metal layer. The top metal layer includes a sub-layer of relatively stiff material compared to the remaining portion of the top metal layer. The sub-layer of relatively stiff material is configured to distribute stresses over the insulation layer to reduce cracking in the insulation layer.

Abstract: A semiconductor structure comprises a top metal layer, a bond pad formed on the top metal layer, a conductor formed below the top metal layer, and an insulation layer separating the conductor from the top metal layer. The top metal layer includes a sub-layer of relatively stiff material compared to the remaining portion of the top metal layer. The sub-layer of relatively stiff material is configured to distribute stresses over the insulation layer to reduce cracking in the insulation layer.

Abstract: A method of forming a semiconductor structure is provided. One method comprises forming a device region between a substrate and a bond pad. Patterning a conductor between the bond pad and the device region with gaps. Filling the gaps with insulation material that is harder than the conductor to form pillars of relatively hard material that extend through the conductor and forming an insulation layer of the insulation material between the conductor and the bond pad.

Abstract: A method of forming a semiconductor structure is provided. One method comprises forming a device region between a substrate and a bond pad. Patterning a conductor between the bond pad and the device region with gaps. Filling the gaps with insulation material that is harder than the conductor to form pillars of relatively hard material that extend through the conductor and forming an insulation layer of the insulation material between the conductor and the bond pad.

Abstract: A method of forming a semiconductor structure is provided. One method comprises forming a device region between a substrate and a bond pad. Patterning a conductor between the bond pad and the device region with gaps. Filling the gaps with insulation material that is harder than the conductor to form pillars of relatively hard material that extend through the conductor and forming an insulation layer of the insulation material between the conductor and the bond pad.

Abstract: A semiconductor structure is provided. In one embodiment, the structure comprises at least one active device located in a substrate and directly under a bond pad. A conductor is located between the bond pad and the substrate. The conductor has a plurality of gaps filled with insulating material. The insulating material is harder than the conductor.

Abstract: A method of forming a semiconductor structure is provided. One method comprises forming a device region between a substrate and a bond pad. Patterning a conductor between the bond pad and the device region with gaps. Filling the gaps with insulation material that is harder than the conductor to form pillars of relatively hard material that extend through the conductor and forming an insulation layer of the insulation material between the conductor and the bond pad.

Abstract: An integrated circuit with circuits under a bond pad. In one embodiment, the integrated circuit comprises a substrate, a top conductive layer, one or more intermediate conductive layers, layers of insulating material and devices. The top conductive layer has a at least one bonding pad and a sub-layer of relatively stiff material. The one or more intermediate conductive layers are formed between the top conductive layer and the substrate. The layers of insulating material separate the conductive layers. Moreover, one layer of the layers of insulating material is relatively hard and is located between the top conductive layer and an intermediate conductive layer closest to the top conductive layer. The devices are formed in the integrated circuit. In addition, at least the intermediate conductive layer closest to the top conductive layer is adapted for functional interconnections of select devices under the bond pad.

Abstract: An earth-boring bit has a bit body that includes head sections, each having depending bit legs with a circumferentially extending outer surface, a leading side, and a trailing side. A bearing shaft depends inwardly from each of the bit legs for mounting a cutter. The bit includes a beveled surface formed at a junction of the leading side and the outer surface of each bit leg. The beveled surface is angled relative to a radial plane emenating from the axis of the bit. The angle of the beveled surface is at least 20 degrees, and extends to an inner surface of the bit leg. The bit can also have a layer of hardfacing on the leading, trailing and shirttail surfaces of the bit leg. A diversion finger of hardfacing extends circumferentially to direct cuttings.

Abstract: An integrated circuit with circuits under a bond pad. In one embodiment, the integrated circuit comprises a substrate, a top conductive layer, one or more intermediate conductive layers, layers of insulating material and devices. The top conductive layer has a at least one bonding pad and a sub-layer of relatively stiff material. The one or more intermediate conductive layers are formed between the top conductive layer and the substrate. The layers of insulating material separate the conductive layers. Moreover, one layer of the layers of insulating material is relatively hard and is located between the top conductive layer and an intermediate conductive layer closest to the top conductive layer. The devices are formed in the integrated circuit. In addition, at least the intermediate conductive layer closest to the top conductive layer is adapted for functional interconnections of select devices under the bond pad.

Abstract: An integrated circuit with circuits under a bond pad. In one embodiment, the integrated circuit comprises a substrate, a top conductive layer, one or more intermediate conductive layers, layers of insulating material and devices. The top conductive layer has a at least one bonding pad and a sub-layer of relatively stiff material. The one or more intermediate conductive layers are formed between the top conductive layer and the substrate. The layers of insulating material separate the conductive layers. Moreover, one layer of the layers of insulating material is relatively hard and is located between the top conductive layer and an intermediate conductive layer closest to the top conductive layer. The devices are formed in the integrated circuit. In addition, at least the intermediate conductive layer closest to the top conductive layer is adapted for functional interconnections of select devices under the bond pad.

Abstract: An earth-boring bit has a bit body that includes head sections, each having depending bit legs with a circumferentially extending outer surface, a leading side, and a trailing side. A bearing shaft depends inwardly from each of the bit legs for mounting a cutter. The bit includes a beveled surface formed at a junction of the leading side and the outer surface of each bit leg. The beveled surface is angled relative to a radial plane emenating from the axis of the bit. The angle of the beveled surface is at least 20 degrees, and extends to an inner surface of the bit leg. The bit can also have a layer of hardfacing on the leading, trailing and shirttail surfaces of the bit leg. A diversion finger of hardfacing extends circumferentially to direct cuttings.

Abstract: A gage scraper cleans mud from the gage surface of a rotary cone of a drill bit. The bit has a body having at least one leg depending therefrom, a bearing pin secured to each leg, and a rotary cutting cone mounted to the bearing pin. The cone has a conical gage surface. The gage scraper mounts on the inside of each leg and protrudes from the leg toward the cone into close proximity with the gage surface.

Abstract: An integrated circuit with circuits under a bond pad. In one embodiment, the integrated circuit comprises a substrate, a top conductive layer, one or more intermediate conductive layers, layers of insulating material and devices. The top conductive layer has a at least one bonding pad and a sub-layer of relatively stiff material. The one or more intermediate conductive layers are formed between the top conductive layer and the substrate. The layers of insulating material separate the conductive layers. Moreover, one layer of the layers of insulating material is relatively hard and is located between the top conductive layer and an intermediate conductive layer closest to the top conductive layer. The devices are formed in the integrated circuit. In addition, at least the intermediate conductive layer closest to the top conductive layer is adapted for functional interconnections of select devices under the bond pad.

Abstract: A semiconductor test system includes at least one semiconductor wafer having working dies and at least one test die formed therein. Each of the working dies includes at least one bipolar transistor. A tester selectively supplies a changing direct current (DC) input signal to a selected test die and monitors a DC output signal therefrom. Each test die includes a test oscillator having at least one sample bipolar transistor substantially identical to the bipolar transistors of the working dies. The test oscillator switches between a non-oscillating state and an oscillating state as the DC input signal changes, and generates the DC output signal to the tester indicative of switching between the non-oscillating state and the oscillating state. A threshold level of a bias current that causes the test oscillator to switch between the non-oscillating state and the oscillating state is correlated to the maximum oscillation frequency and the transition frequency of the sample bipolar transistor.

Abstract: A first thin film resistor formed by direct etch or lift off on a first dielectric layer that covers an integrated circuit in a substrate. A second thin film resistor comprised of a different material than the first resistor, formed by direct etch or lift off on the first dielectric layer or on a second dielectric layer over the first dielectric layer. The first and second thin film resistors are interconnected with another electronic device such as other resistors or the integrated circuit.