Abstract: A fluid ejection device may include a laminate fluid manifold comprising plates extending in a plane and stacked in a laminate plate stack. The stack may include a first fluid passage extending parallel to and between plates of the laminate plate stack and a second fluid passage extending parallel to and between plates of the laminate plate stack. The first fluid passage and the second fluid passage overlap when viewed from a direction perpendicular to the plane.

Abstract: A fluid ejection device may include a laminate fluid manifold comprising plates extending in a plane and stacked in a laminate plate stack. The stack may include a first fluid passage extending parallel to and between plates of the laminate plate stack and a second fluid passage extending parallel to and between plates of the laminate plate stack. The first fluid passage and the second fluid passage overlap when viewed from a direction perpendicular to the plane.

Abstract: A fluid ejection device may include a laminate fluid manifold including plates in a laminate plate stack. The stack may include a fluid passage extending to an edge of the laminate plate stack. A die maybe secured across the edge of the laminate plate stack, wherein the die includes opening to receive fluid transmitted through the fluid passage.

Abstract: A fluid ejection device may include a laminate fluid manifold including plates in a laminate plate stack. The stack may include a fluid passage extending to an edge of the laminate plate stack. A die maybe secured across the edge of the laminate plate stack, wherein the die includes opening to receive fluid transmitted through the fluid passage.

Abstract: Laminate manifolds, and their manufacture. The laminate manifolds (18) include plates (20) arranged in parallel, forming a laminate plate stack (22), with a securing agent (24) securing the plates in the plate stack. At least some of the plates incorporate apertures (26) that are oriented in their respective plates so that when the plates are arranged in the laminate plate stack (22), the apertures define a fluidic pathway (28) that emerges from the laminate plate stack between parallel plates. The laminate manifolds are particularly useful as ink manifolds (14) for inkjet printers (10).

Abstract: A method for adhesive stacking includes dispensing a first line of adhesive onto a first substrate; dispensing at least one additional line of adhesive stacked onto the first line of adhesive; and placing a second substrate onto the at least one additional line of adhesive to join the first and second substrates.

Abstract: A method for adhesive stacking includes dispensing a first line of adhesive onto a first substrate; dispensing at least one additional line of adhesive stacked onto the first line of adhesive; and placing a second substrate onto the at least one additional line of adhesive to join the first and second substrates.

Abstract: Laminate manifolds, and their manufacture. The laminate manifolds (18) include plates (20) arranged in parallel, forming a laminate plate stack (22), with a securing agent (24) securing the plates in the plate stack. At least some of the plates incorporate apertures (26) that are oriented in their respective plates so that when the plates are arranged in the laminate plate stack (22), the apertures define a fluidic pathway (28) that emerges from the laminate plate stack between parallel plates. The laminate manifolds are particularly useful as ink manifolds (14) for inkjet printers (10).

Abstract: The described embodiments relate to features in substrates and methods of forming same. One exemplary embodiment can be a microdevice that includes a substrate extending between a first substrate surface and a generally opposing second substrate surface, and at least one feature formed into the first surface along a bore axis that is not transverse to the first surface.

Abstract: In one embodiment a method of making an electrostatic actuator includes: forming a first conductor over a first substrate to form a first structure; forming a flexible second conductor over a second substrate to form a second structure; forming an etch stop over the first conductor as part of the first structure or over the second conductor as part of the second structure; forming a spacer on the etch stop, the spacer selectively etchable with respect to the etch stop; etching the spacer through to the etch stop at a location of a gap between the first conductor and the second conductor; and bonding the first structure and the second structure together such that the first conductor is located opposite the second conductor across the gap.

Abstract: In one embodiment a method of making an electrostatic actuator includes: forming a first conductor over a first substrate to form a first structure; forming a flexible second conductor over a second substrate to form a second structure; forming an etch stop over the first conductor as part of the first structure or over the second conductor as part of the second structure; forming a spacer on the etch stop, the spacer selectively etchable with respect to the etch stop; etching the spacer through to the etch stop at a location of a gap between the first conductor and the second conductor; and bonding the first structure and the second structure together such that the first conductor is located opposite the second conductor across the gap.

Abstract: The described embodiments relate to features in substrates and methods of forming same. One exemplary embodiment can be a microdevice that includes a substrate extending between a first substrate surface and a generally opposing second substrate surface, and at least one feature formed into the first surface along a bore axis that is not transverse to the first surface.

Abstract: A light source comprises a plurality of light emitting diodes arranged around the perimeter of a reflective optical element, wherein each of the light emitting diodes selectively generates a light beam directed to the reflective optical element. The reflective optical element generates a light path by collimating and reflecting the selectively generated light beams from each of the light emitting diodes.

Abstract: A wetting zone is defined within a substrate. A conductive material is applied to the wetting zone. A conductive trace is at least partially formed within the wetting zone from the conductive material flowing throughout the wetting zone by wicking action.

Abstract: The described embodiments relate to features in substrates and methods of forming same. One exemplary embodiment can be a microdevice that includes a substrate extending between a first substrate surface and a generally opposing second substrate surface, and at least one feature formed into the first surface along a bore axis that is not transverse to the first surface.

Abstract: Fluid-ejection devices capable of ejecting fluid onto media and methods for their manufacture are provided. One embodiment includes adhering a fluid-ejecting substrate of the fluid-ejection device to a carrier of the fluid-ejection device by drawing an adhesive between the fluid-ejecting substrate and the carrier using capillary action.

Abstract: Fluid-ejection devices capable of ejecting fluid onto media and methods for their manufacture are provided. One embodiment includes adhering a fluid-ejecting substrate of the fluid-ejection device to a carrier of the fluid-ejection device by drawing an adhesive between the fluid-ejecting substrate and the carrier using capillary action.