Patents by Inventor Chris Bakker

Chris Bakker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Crack detection circuits for printheads
    Patent number: 8888226
    Abstract: Crack detection circuits for printheads are described. In an example, a crack detection circuit for at least one printhead, includes: crack detectors formed on the at least one printhead; switches selectively coupling the crack detectors on each printhead to a communication bus; and a configuration circuit on each printhead coupled to control inputs of the respective switches, each configuration circuit responsive to a crack detection configuration input to control the respective switches.
    Type: Grant
    Filed: June 25, 2013
    Date of Patent: November 18, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James M. Gardner, Chris Bakker, Eric T. Martin
  • Power distribution in a thermal ink jet printhead
    Patent number: 8444255
    Abstract: A thermal inkjet printhead may include a substrate and a resistive layer. A thermal resistor may be formed in the resistive layer. A first metal layer may be between the substrate and a resistive layer having a thickness to form a power bus. A dielectric layer may be between the first metal layer and the resistive layer.
    Type: Grant
    Filed: May 18, 2011
    Date of Patent: May 21, 2013
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chris Bakker, Lawrence H. White, Bjorn Warloe, Reynaldo V. Villavelez, Paul I. Mikulan, Kenneth Stewart, Michael Allen Godwin, Teck-Khim Neo, Joseph M. Torgerson, Lonnie Byers
  • THERMAL INK JET PRINTHEAD
    Publication number: 20120293587
    Abstract: A thermal inkjet printhead may include a substrate and a resistive layer. A thermal resistor may be formed in the resistive layer. A first metal layer may be between the substrate and a resistive layer having a thickness to form a power bus. A dielectric layer may be between the first metal layer and the resistive layer.
    Type: Application
    Filed: May 18, 2011
    Publication date: November 22, 2012
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chris Bakker, Lawrence H. White, Bjorn Warloe, Reynaldo V. Villavelez, Paul I. Mikulan, Kenneth Stewart, Michael Allen Godwin, Teck-Khim Neo, Joe Torgerson, Lonnie Byers
  • THERMAL FLUID-EJECTION DEVICE DIE
    Publication number: 20110175959
    Abstract: A die for a thermal drop-on-demand fluid-ejection device includes thermal firing resistors, low-side switches, and high-side switches. The thermal firing resistors are organized over resistor groups such that each thermal firing resistor is located within only one of the resistor groups. The resistor groups are lesser in number than the thermal firing resistors. Each thermal firing resistor has a first end and a second end. The low-side switches are equal in number to the thermal firing resistors. Each low-side switch connects the second end of a corresponding thermal firing resistor to a low voltage. The high-side switches are equal in number to the resistor groups. Each high-side switch connects the first ends of the thermal firing resistors of a corresponding resistor group to power providing a voltage greater than the low voltage.
    Type: Application
    Filed: October 31, 2008
    Publication date: July 21, 2011
    Inventors: Andrew L. Van Brocklin, Chris Bakker, Mark Hunter, Eric Martin
  • Moving a structure
    Publication number: 20080100896
    Abstract: Embodiments of moving a structure using a bubble are disclosed.
    Type: Application
    Filed: October 30, 2006
    Publication date: May 1, 2008
    Inventors: Manish Giri, Chris Bakker, Joshua M. Yu, Jeremy Harlan Donaldson