Abstract: A method and device include an organic multiple layer substrate having patterned conductors disposed on a recessed layer of the organic multiple layer substrate. A discrete component is coupled to the recessed layer such that the component is recessed from a top layer of the organic multiple layer substrate.

Abstract: A hair styling apparatus including a magnetron and a styling base in communication with the magnetron for styling a moistened lock of hair is provided. A shield removably encases the styling base for shielding microwave radiation emitted from the magnetron. The lock of hair is heated upon activation of the magnetron. Methods of curling and straightening hair are also provided.

Abstract: A hair styling apparatus including a magnetron and a styling base in communication with the magnetron for styling a moistened lock of hair is provided. A shield removably encases the styling base for shielding microwave radiation emitted from the magnetron. The lock of hair is heated upon activation of the magnetron. Methods of curling and straightening hair are also provided.

Abstract: A fiber optic shape determination system having at least one optical fiber for placement within or along an elongated structure. The optical fiber defines an optical path for conveying an optical signal. The optical path manifests an interaction with the optical signal wherein the interaction occurs in a continuous fashion during the propagation of the optical signal along the optical path and produces a measurable response, the response conveying information about strain imparted to the optical fiber and a location along the optical fiber at which the strain occurs. The shape determination system also has a measurement component coupled to the optical fiber to sense the response and for determining the strain applied at different locations along the fiber and for deriving a shape of optic fiber, accordingly.

Abstract: A microelectronic device package including an electrically conductive lid having an attachment surface, a substrate having an attachment surface, at least one interconnect extending between the lid attachment surface and the substrate attachment surface, at least one microelectronic die disposed between the lid attachment surface and the substrate attachment surface, and the substrate having at least one first conductive trace extending between the electrically conductive first interconnect and the microelectronic die. The microelectronic device package allows for the use of the electrically conductive lid as a path for conducting signals (preferably power or ground) to and/or from a microelectronic die.

Abstract: An electronic package includes an IC, such as a die, mounted onto one side of a thin interposer and a pin carrier mounted to an opposing side of the interposer. The pin carrier includes a cavity underneath the die. The cavity allows capacitors, or other electronic components, to be mounted against the interposer beneath the die. The cavity in the pin carrier is filled with an encapsulant to mechanically support the thin interposer in the area of the cavity during operation of an electronic system that includes the package.

Abstract: An integrated circuit including a die, a power terminal and a ground terminal all mounted onto a substrate. The power terminal including a body and a first extension projecting from the body, and the ground terminal including a body and a second extension projecting from the body. The second extension on the ground terminal being adjacent to the first extension on the power terminal to offset inductance that is generated by supplying current to the die through the power terminal.

Abstract: An electronic package includes an IC, such as a die, mounted onto one side of a thin interposer and a pin carrier mounted to an opposing side of the interposer. The pin carrier includes a cavity underneath the die. The cavity allows capacitors, or other electronic components, to be mounted against the interposer beneath the die. The cavity in the pin carrier is filled with an encapsulant to mechanically support the thin interposer in the area of the cavity during operation of an electronic system that includes the package.

Abstract: An integrated circuit including a die, a power terminal and a ground terminal all mounted onto a substrate. The power terminal including a body and a first extension projecting from the body, and the ground terminal including a body and a second extension projecting from the body. The second extension on the ground terminal being adjacent to the first extension on the power terminal to offset inductance that is generated by supplying current to the die through the power terminal.

Abstract: An electronic package, such as an integrated circuit package, includes a cavity (310, 410 FIGS. 3, 4) on the back side of the package, which is the same side on which connectors (304, 408, FIGS. 3, 4) to a next level of interconnect are located. Within the cavity are contacts (312, 412, FIGS. 3, 4), which enable one or more discrete capacitors (302, 402, FIGS. 3, 4) to be electrically connected to the package. The package provides a very low vertical inductance path between the capacitors and an integrated circuit (314, FIG. 3) mounted on the front side of the package.

Abstract: An electronic package includes an IC, such as a die, mounted onto one side of a thin interposer and a pin carrier mounted to an opposing side of the interposer. The pin carrier includes a cavity underneath the die. The cavity allows capacitors, or other electronic components, to be mounted against the interposer beneath the die. The cavity in the pin carrier is filled with an encapsulant to mechanically support the thin interposer in the area of the cavity during operation of an electronic system that includes the package.

Abstract: The present invention provides a circuit board with a plated-through hole, wherein a first end of the plated-through hole is electrically attached to a cap formed of conductive material. One or more surface pads terminate on a surface layer of the printed circuit board, and are connected to the cap by one or more vias extending from the cap to the one or more surface pads. In some embodiments, the circuit board is a substrate for mounting an integrated circuit, such as a ball-grid array integrated circuit. The invention includes methods for making the novel circuit board, as well as integrated circuit assemblies comprising the novel circuit board with an integrated circuit mounted thereto.

Abstract: A barbeque rotisserie enclosure includes a hollow vessel for substantially releasably encapsulating food to be barbequed. The hollow vessel includes a hollow cylinder having a first closed end and a second open end the second open end for placing food into the hollow cylinder and the first closed end being permanently sealed with a first end cap. The second open end is releasably sealed with a second end cap; wherein the hollow vessel is capable of being rotated over a heat source. The barbeque rotisserie enclosure further includes a baffle housed concentrically within and adjacent to an inner surface of the hollow cylinder, thereby preventing direct contact of flames with the food and also substantially preventing direct contact of liquids emanating from the food with the heat source.