Abstract: A patient slider device configured to move a patient from a first bed surface to a second bed surface positioned adjacent thereto. The patient slider device includes a frame, a bed engagement assembly and a patient pulling assembly. The bed engagement assembly includes a bumper with the bumper being adjustable relative to the frame. The patient pulling assembly includes a winch assembly, preferably positioned proximate a lower end of the frame, and a sheet engaging clamp assembly. The sheet engaging clamp assembly includes a base member and a locking member structurally configured to clamp a sheet therebetween.

Abstract: An integrated circuit (IC) includes a substrate having a device layer and a plurality of metal layers formed thereon. The plurality of metal layers include patterned upper metal layers and lower metal layers, a multi-level metal interconnect structure formed using the plurality of metal layers, where the interconnect structure is in electrical contact with a first portion and second portion of the device layer. At least one circuit editing structure including a first and second columns are formed using at least a portion of the plurality of metal layers, the first column being in electrical contact with the first portion of the device layer and the second column being in electrical contact with second portion of the device layer, where a portion of the first and second columns define a circuit editing feature operable to electrically couple or decouple the columns using focused ion beam (FIB) processing.

Abstract: An integrated circuit (IC) includes a substrate having a device layer and a plurality of metal layers formed thereon. The plurality of metal layers include patterned upper metal layers and lower metal layers, a multi-level metal interconnect structure formed using the plurality of metal layers, where the interconnect structure is in electrical contact with a first portion and second portion of the device layer. At least one circuit editing structure including a first and second columns are formed using at least a portion of the plurality of metal layers, the first column being in electrical contact with the first portion of the device layer and the second column being in electrical contact with second portion of the device layer, where a portion of the first and second columns define a circuit editing feature operable to electrically couple or decouple the columns using focused ion beam (FIB) processing.

Abstract: This device is a pull release tab in a connection between two lines to be placed under tension. The first line forms an loop by passing one end of the first line through a looplet at the other end. The looplet has a tab affixed to it. The second line has a knot at one end that passes through the loop formed by the first line. When tension is applied to the first and second lines, the loop closes and releasably engages the knot, thus forming a connection between the two lines. To disengage the first line from the second line, the tab is pulled to enlarge the loop to allow the knot to disengage from the loop.