Abstract: The subject technology is directed to a semiconductor device. In an embodiment, the semiconductor device comprises an interposer, which comprises a first side and a second side. The first side is opposite the second side. The device further comprises a first circuit coupled to the first side and a second circuit coupled to the second side. The device further comprises a first layer coupled to the first circuit and a second layer coupled to the second circuit. The second layer is configured to dissipate heat generated by the second circuit. This configuration enhances thermal management by providing a direct thermal path for heat dissipation, improving the overall efficiency and reliability of the semiconductor device. Additionally, the elimination of thermal vias simplifies the PCB layout, allowing for more compact and cost-effective designs.

Abstract: In some aspects, the disclosure is directed a module for improving mechanical, electrical, or thermal performance. In some embodiments, the module includes a bottom surface, a side surface, a first solder bump disposed on the bottom surface, and a second solder bump disposed on the bottom surface. In some embodiments, the bottom surface extends in a first lateral direction and a second lateral direction perpendicular to the first lateral direction. In some embodiments, the side surface extends in a vertical direction perpendicular to the first lateral direction and the second lateral direction. In some embodiments, the second solder bump is adjacent to the side surface. In some embodiments, the first solder bump has a first length in the first lateral direction. In some embodiments, the second solder bump has a second length in the first lateral direction. In some embodiments, the first length is greater than the second length.

Abstract: An apparatus includes a first substrate comprising one or more first interconnection layers, wherein a first die is coupled to a first side of the first substrate, and a second substrate comprising one or more second interconnection layers. The second die may be coupled to a first side of the second substrate, and a third die is coupled to a second side of the second substrate. The first substrate and the second substrate may be stacked together.

Abstract: Techniques are disclosed by which a coding parameter is determined to encode video data resulting in encoded video data possessing a highest possible video quality. Features may be extracted from an input video sequence. The extracted features may be compared to features described in a model of coding parameters generated by a machine learning algorithm from reviews of previously-coded videos, extracted features of the previously-coded videos, and coding parameters of the previously-coded videos. When a match is detected between the extracted features of the input video sequence and extracted features represented in the model, a determination may be made as to whether coding parameters that correspond to the matching extracted feature correspond to a tier of service to which the input video sequence is to be coded.

Abstract: A device and substrate are disclosed. An illustrative device includes a substrate having a first surface and an opposing second surface, a solder material receiving curved surface exposed at the second surface of the substrate, a solder resist material that at least partially covers the solder material receiving curved surface such that a middle portion of the solder receiving curved surface is exposed and such that an edge portion of the solder material receiving curved surface is covered by the solder resist material and forms an undercut, and a solder material disposed within the solder material receiving curved surface and within the undercut.

Abstract: In some aspects, the disclosure is directed a module for improving mechanical, electrical, or thermal performance. In some embodiments, the module includes a bottom surface, a side surface, a first solder bump disposed on the bottom surface, and a second solder bump disposed on the bottom surface. In some embodiments, the bottom surface extends in a first lateral direction and a second lateral direction perpendicular to the first lateral direction. In some embodiments, the side surface extends in a vertical direction perpendicular to the first lateral direction and the second lateral direction. In some embodiments, the second solder bump is adjacent to the side surface. In some embodiments, the first solder bump has a first length in the first lateral direction. In some embodiments, the second solder bump has a second length in the first lateral direction. In some embodiments, the first length is greater than the second length.

Abstract: In some aspects, the disclosure is directed a module for improving mechanical, electrical, or thermal performance. In some embodiments, the module includes a bottom surface, a side surface, a first solder bump disposed on the bottom surface, and a second solder bump disposed on the bottom surface. In some embodiments, the bottom surface extends in a first lateral direction and a second lateral direction perpendicular to the first lateral direction. In some embodiments, the side surface extends in a vertical direction perpendicular to the first lateral direction and the second lateral direction. In some embodiments, the second solder bump is adjacent to the side surface. In some embodiments, the first solder bump has a first length in the first lateral direction. In some embodiments, the second solder bump has a second length in the first lateral direction. In some embodiments, the first length is greater than the second length.

Abstract: An apparatus includes a first substrate comprising one or more first interconnection layers, wherein a first die is coupled to a first side of the first substrate, and a second substrate comprising one or more second interconnection layers. The second die may be coupled to a first side of the second substrate, and a third die is coupled to a second side of the second substrate. The first substrate and the second substrate may be stacked together.

Abstract: A passive component includes a body including a dummy portion and a device portion. The dummy portion and the device portion extend in a first direction and are arranged such that a longitudinal axis of the device portion is offset from a longitudinal axis of the body in a second direction perpendicular to the first direction. The passive component further includes first and second electrical contacts on at least one surface of the body.

Abstract: In some aspects, the disclosure is directed a module for improving mechanical, electrical, or thermal performance. In some embodiments, the module includes a bottom surface, a side surface, a first solder bump disposed on the bottom surface, and a second solder bump disposed on the bottom surface. In some embodiments, the bottom surface extends in a first lateral direction and a second lateral direction perpendicular to the first lateral direction. In some embodiments, the side surface extends in a vertical direction perpendicular to the first lateral direction and the second lateral direction. In some embodiments, the second solder bump is adjacent to the side surface. In some embodiments, the first solder bump has a first length in the first lateral direction. In some embodiments, the second solder bump has a second length in the first lateral direction. In some embodiments, the first length is greater than the second length.

Abstract: A device and substrate are disclosed. An illustrative device includes a substrate having a first surface and an opposing second surface, a solder material receiving curved surface exposed at the second surface of the substrate, a solder resist material that at least partially covers the solder material receiving curved surface such that a middle portion of the solder receiving curved surface is exposed and such that an edge portion of the solder material receiving curved surface is covered by the solder resist material and forms an undercut, and a solder material disposed within the solder material receiving curved surface and within the undercut.

Abstract: A device and substrate are disclosed. An illustrative device includes a substrate having a first surface and an opposing second surface, a solder material receiving curved surface exposed at the second surface of the substrate, a solder resist material that at least partially covers the solder material receiving curved surface such that a middle portion of the solder receiving curved surface is exposed and such that an edge portion of the solder material receiving curved surface is covered by the solder resist material and forms an undercut, and a solder material disposed within the solder material receiving curved surface and within the undercut.

Abstract: Techniques are disclosed by which a coding parameter is determined to encode video data resulting in encoded video data possessing a highest possible video quality. Features may be extracted from an input video sequence. The extracted features may be compared to features described in a model of coding parameters generated by a machine learning algorithm from reviews of previously-coded videos, extracted features of the previously-coded videos, and coding parameters of the previously-coded videos. When a match is detected between the extracted features of the input video sequence and extracted features represented in the model, a determination may be made as to whether coding parameters that correspond to the matching extracted feature correspond to a tier of service to which the input video sequence is to be coded.

Abstract: Techniques are disclosed by which a coding parameter is determined to encode video data resulting in encoded video data possessing a highest possible video quality. Features may be extracted from an input video sequence. The extracted features may be compared to features described in a model of coding parameters generated by a machine learning algorithm from reviews of previously-coded videos, extracted features of the previously-coded videos, and coding parameters of the previously-coded videos. When a match is detected between the extracted features of the input video sequence and extracted features represented in the model, a determination may be made as to whether coding parameters that correspond to the matching extracted feature correspond to a tier of service to which the input video sequence is to be coded.

Abstract: Techniques are disclosed for managing display of content from multi-view video data. According to these techniques, an object may be identified from content of the multi-view video. The object's location may be tracked across a sequence of multi-view video. The technique may extract a sub-set of video that is contained within a view window that is shifted in an image space of the multi-view video in correspondence to the tracked object's location. These techniques may be implemented either in an image source device or an image sink device.

Abstract: A device and substrate are disclosed. An illustrative device includes a substrate having a first surface and an opposing second surface, a solder material receiving curved surface exposed at the second surface of the substrate, a solder resist material that at least partially covers the solder material receiving curved surface such that a middle portion of the solder receiving curved surface is exposed and such that an edge portion of the solder material receiving curved surface is covered by the solder resist material and forms an undercut, and a solder material disposed within the solder material receiving curved surface and within the undercut.

Abstract: A passive component includes a body including a dummy portion and a device portion. The dummy portion and the device portion extend in a first direction and are arranged such that a longitudinal axis of the device portion is offset from a longitudinal axis of the body in a second direction perpendicular to the first direction. The passive component further includes first and second electrical contacts on at least one surface of the body.

Abstract: Techniques are disclosed for coding high dynamic range (HDR) data. According to such techniques, HDR data may be converted to a domain of uniform luminance data. The uniform domain data may be coded by motion compensated predictive coding. The HDR data also may be coded by motion compensated predictive coding, using a coding parameter that is derived from a counterpart coding parameter of the coding of the uniform domain data. In another technique, HDR data may be coded using coding parameters that are derived from HDR domain processing but distortion measurements may be performed in a uniform domain.

Abstract: Systems and methods are disclosed for reshaping HDR video content to improve compression efficiency while using standard encoding/decoding techniques. Input HDR video frames, e.g., represented in an IPT color space, may be reshaped before the encoding/decoding process and the corresponding reconstructed HDR video frames may then be reverse reshaped. The disclosed reshaping methods may be combinations of scene-based or segment-based methods.

Abstract: Systems and methods are disclosed for reshaping HDR video content to improve compression efficiency while using standard encoding/decoding techniques. Input HDR video frames, e.g., represented in an IPT color space, may be reshaped before the encoding/decoding process and the corresponding reconstructed HDR video frames may then be reverse reshaped. The disclosed reshaping methods may be combinations of scene-based or segment-based methods.