Patents by Inventor Chris E. Karlsrud

Chris E. Karlsrud has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5791975
    Abstract: A method of fabricating a soft, resilient backing pad adapted for attachment to a pressure plate for planarizing work pieces wherein the outer exposed surface of the pad has been abraded by means of dry abrasive particles fixed on a surface of a spherical convex lapping wheel.
    Type: Grant
    Filed: August 9, 1995
    Date of Patent: August 11, 1998
    Assignee: Speedfam Corporation
    Inventors: Joseph V. Cesna, Chris E. Karlsrud, Spencer Preston
  • Patent number: 5498196
    Abstract: A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers by wafer holding apparatus of an index table. Similarly, a plurality of wafer carriers are substantially simultaneously unloaded into wafer holding apparatus of the index table. The wafer carriers are individually computer controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.
    Type: Grant
    Filed: May 18, 1994
    Date of Patent: March 12, 1996
    Assignee: Speedfam Corporation
    Inventors: Chris E. Karlsrud, Anthony G. Van Woerkom, Shigeru Odagiri, Isao Nagahashi
  • Patent number: 5498199
    Abstract: A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers by wafer holding apparatus of an index table. Similarly, a plurality of polished wafers are substantially simultaneously unloaded from the plurality of wafer carriers into wafer holding apparatus of the index table. The wafer carriers are individually computer controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.
    Type: Grant
    Filed: July 15, 1994
    Date of Patent: March 12, 1996
    Assignee: Speedfam Corporation
    Inventors: Chris E. Karlsrud, Anthony G. Van Woerkom, Shigeru Odagiri, Isao Nagahashi, Spencer Preston
  • Patent number: 5329732
    Abstract: A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers by wafer holding apparatus of an index table. Similarly, a plurality of wafer carriers are substantially simultaneously unloaded into wafer holding apparatus of the index table. The wafer carriers are individually computer controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.
    Type: Grant
    Filed: June 15, 1992
    Date of Patent: July 19, 1994
    Assignee: Speedfam Corporation
    Inventors: Chris E. Karlsrud, Anthony G. Van Woerkom, Shigeru Odagiri, Isao Nagahashi
  • Patent number: 5274960
    Abstract: A machine for simultaneously finishing two sides of a workpiece simultaneously, the machine having a base, an upper polishing plate, a lower polishing plate, a carrier holding one or more workpieces between the upper and lower polishing plates, a motor attached to a spindle having a first axis, which is fixedly attached to a spindle cam having a second axis such that when the spindle rotates about the first axis, the second axis of the spindle cam moves in a circular non-rotational manner circumscribing a circle having a radius defining a critical radius. The movement of the circular spindle cam causes the lower polishing plate to move in a circular non-rotational manner. The lower polishing plate is connected to one or more eccentric cams by one or more lower polishing plate linkages. The circular non-rotational movement of the lower polishing plate is transferred to the upper polishing plate by one or more eccentric cams via lower polishing plate linkages, and one or more upper polishing plate linkages.
    Type: Grant
    Filed: October 23, 1990
    Date of Patent: January 4, 1994
    Assignee: Speedfam Corporation
    Inventor: Chris E. Karlsrud
  • Patent number: 5187901
    Abstract: A disc finishing machine comprising an annular upper platen, lower platen, a center driving ring, a plurality of a clamping guide rollers, a plurality of stationary guide rollers, a clamping guide roller, and stationary guide roller perpendicularly attached to one of a plurality of a roller stanchions. The polishing machine capable of imparting a circumferential pattern on a plurality of disc-shaped work pieces.
    Type: Grant
    Filed: February 2, 1990
    Date of Patent: February 23, 1993
    Assignee: Speedfam Corporation
    Inventor: Chris E. Karlsrud
  • Patent number: 5123218
    Abstract: A disc finishing method using a machine comprising an annular upper platen, lower platen, a center driving ring, a plurality of a clamping guide rollers, a plurality of stationary guide rollers, a clamping guide roller, and stationary guide roller perpendicularly attached to one of a plurality of a roller stanchions. The polishing machine capable of imparting a circumferential pattern on a plurality of disc-shaped work pieces.
    Type: Grant
    Filed: July 23, 1991
    Date of Patent: June 23, 1992
    Assignee: Speedfam Corporation
    Inventor: Chris E. Karlsrud
  • Patent number: RE37622
    Abstract: A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers by wafer holding apparatus of an index table. Similarly, a plurality of wafer carriers are substantially simultaneously unloaded into wafer holding apparatus of the index table. The wafer carriers are individually computer controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.
    Type: Grant
    Filed: January 24, 1997
    Date of Patent: April 2, 2002
    Assignee: SpeedFam-IPEC Corporation
    Inventors: Chris E. Karlsrud, Anthony G. Van Woerkom, Shigeru Odagiri, Isao Nagahashi