Abstract: The solar array is attached to a support structure which permits it to pivot about two non-parallel and non-intersecting axes. The array may then be easily moved to track the sun, maintaining the production of electricity. The structure may be adapted for attachment to a surface such as the ground.

Abstract: Various technologies and techniques are disclosed for presenting and browsing hierarchical data. A hierarchical chart is displayed with a primary entity being displayed in a center region of the display. One or more peers to the primary entity are displayed along a horizontal axis in comparison to the primary entity. One or more parents to the primary entity are displayed above the primary entity, and one or more children to the primary entity are displayed beneath the primary entity. A method for performing searches against a hierarchical chart is also described. Input is received for a name to search for in a hierarchical chart. A filter criteria selection is received. A search is performed against the hierarchical chart to find one or more matching records that match the name and the filter criteria. The one or more matching records are displayed, with at least a name and photo.

Abstract: The solar array is attached to a support structure which permits it to pivot about two non-parallel and non-intersecting axes. The array may then be easily moved to track the sun, maintaining the production of electricity. The structure may be adapted for attachment to a surface such as the ground.

Abstract: An Enterprise Service Delivery Technical Architecture includes a Technical Model, and a Technical Delivery Framework, and is designed to facilitate the development of complete enterprise service management solutions. The use of the Enterprise Service Delivery Technical Architecture as the framework for an enterprise systems management technical solution results in solution designs created to be independent of the technology platform being managed with a view that meets the overall business requirements that span the technology platforms within a business environment. An information technology infrastructure already in place for a customer is analyzed and broken down to its very lowest level building blocks. Then the building blocks within the model of the technical architecture are mapped with the building blocks of the customer's information technology infrastructure to determine which of the building blocks of the model are to be used for the customer's information technology operation.

Abstract: In a method and system for fabricating a thermally enhanced semiconductor device (200, 300) is packaged as a through hole single inline package (SIP). A leadframe (210, 310, 410) having a die pad (220, 320, 420) to attach an IC die (230, 330), a first plurality of conductive leads (240, 340, 430) formed from a first portion of metal sheet (432), and a second portion of metal sheet (440) disposed on an opposite side of the IC die (230, 330) as the first plurality of conductive leads is stamped from a metal sheet. The first plurality of conductive leads (240, 340, 430) are arranged in a single line and are capable of being through hole mounted in accordance with the SIP. The second portion of metal sheet (440) includes the die pad (420) to form a heat spreader (260, 360) in the form of the metal sheet. The heat spreader (260, 360) provides heat dissipating for the heat generated by the IC die (230, 330).

Abstract: A sensor for an engine manifold is provided that includes a sensing component positioned within the engine manifold and responsive to a condition, such as temperature or pressure, within the engine manifold. The sensor includes a shield partially surrounding the sensing component upstream of the sensing component in flow within the manifold, which includes exhaust gases and manifold intake air. The shield does not surround a downstream side of the sensing component. The shield minimizes contamination of the sensing component by contaminants within the exhaust gases or manifold intake air, without compromising responsiveness of the sensing component to changes in the sensed condition, as the sensing component is still directly open to the manifold air (i.e., the exhaust gases and intake air).

Abstract: A sensor for an engine manifold is provided that includes a sensing component positioned within the engine manifold and responsive to a condition, such as temperature or pressure, within the engine manifold. The sensor includes a shield partially surrounding the sensing component upstream of the sensing component in flow within the manifold, which includes exhaust gases and manifold intake air. The shield does not surround a downstream side of the sensing component. The shield minimizes contamination of the sensing component by contaminants within the exhaust gases or manifold intake air, without compromising responsiveness of the sensing component to changes in the sensed condition, as the sensing component is still directly open to the manifold air (i.e., the exhaust gases and intake air).

Abstract: In a method and system for fabricating a thermally enhanced semiconductor device (200, 300) is packaged as a through hole single inline package (SIP). A leadframe (210, 310, 410) having a die pad (220, 320, 420) to attach an IC die (230, 330), a first plurality of conductive leads (240, 340, 430) formed from a first portion of metal sheet (432), and a second portion of metal sheet (440) disposed on an opposite side of the IC die (230, 330) as the first plurality of conductive leads is stamped from a metal sheet. The first plurality of conductive leads (240, 340, 430) are arranged in a single line and are capable of being through hole mounted in accordance with the SIP. The second portion of metal sheet (440) includes the die pad (420) to form a heat spreader (260, 360) in the form of the metal sheet. The heat spreader (260, 360) provides heat dissipating for the heat generated by the IC die (230, 330).

Abstract: An Enterprise Service Delivery Technical Architecture includes a Technical Model, and a Technical Delivery Framework, and is designed to facilitate the development of complete enterprise service management solutions. The use of the Enterprise Service Delivery Technical Architecture as the framework for an enterprise systems management technical solution results in solution designs created to be independent of the technology platform being managed with a view that meets the overall business requirements that span the technology platforms within a business environment. An information technology infrastructure already in place for a customer is analyzed and broken down to its very lowest level building blocks. Then the building blocks within the model of the technical architecture are mapped with the building blocks of the customer's information technology infrastructure to determine which of the building blocks of the model are to be used for the customer's information technology operation.

Abstract: An Enterprise Service Delivery Technical Architecture includes a Technical Model, and a Technical Delivery Framework, and is designed to facilitate the development of complete enterprise service management solutions. The use of the Enterprise Service Delivery Technical Architecture as the framework for an enterprise systems management technical solution results in solution designs created to be independent of the technology platform being managed with a view that meets the overall business requirements that span the technology platforms within a business environment. An information technology infrastructure already in place for a customer is analyzed and broken down to its very lowest level building blocks. Then the building blocks within the model of the technical architecture are mapped with the building blocks of the customer's information technology infrastructure to determine which of the building blocks of the model are to be used for the customer's information technology operation.

Abstract: The present invention provides a method, apparatus, and computer program product for implementing a business systems management solution for end-to-end event management. The present invention realizes a number of business systems management functionalities, including defining event databases and means for event monitoring and correlating a customer's business functions by using an enterprise view focused on a system of applications, operating systems, connections, and physical components. Together these components make up a business system as defined by the customer. As such, a business system can cross technology platforms, physical space, and comprise multiple applications, or a business system could be limited to a single platform, location, and application.

Abstract: The present invention provides a method, apparatus, and computer program product for implementing a business systems management solution for end-to-end event management. The present invention realizes a number of business systems management functionalities, including defining event databases and means for event monitoring and correlating a customer's business functions by using an enterprise view focused on a system of applications, operating systems, connections, and physical components. Together these components make up a business system as defined by the customer. As such, a business system can cross technology platforms, physical space, and comprise multiple applications, or a business system could be limited to a single platform, location, and application.

Abstract: In a method and system for fabricating a thermally enhanced semiconductor device (200, 300) is packaged as a through hole single inline package (SIP). A leadframe (210, 310, 410) having a die pad (220, 320, 420) to attach an IC die (230, 330), a first plurality of conductive leads (240, 340, 430) formed from a first portion of metal sheet (432), and a second portion of metal sheet (440) disposed on an opposite side of the IC die (230, 330) as the first plurality of conductive leads is stamped from a metal sheet. The first plurality of conductive leads (240, 340, 430) are arranged in a single line and are capable of being through hole mounted in accordance with the SIP. The second portion of metal sheet (440) includes the die pad (420) to form a heat spreader (260, 360) in the form of the metal sheet. The heat spreader (260, 360) provides heat dissipating for the heat generated by the IC die (230, 330).

Abstract: One embodiment of the present Invention includes an integrated circuit (IC) package. The IC package comprises a semiconductor die comprising at least one IC. The semiconductor die can include a plurality of conductive elements disposed on a first surface of the semiconductor die. The IC package also comprises a die pad coupled to a second surface of the semiconductor die. The IC package further comprises a leadframe comprising a plurality of leadfingers to which a portion of the conductive elements are conductively coupled. At least a portion of the plurality of leadfingers can be interdigitated with at least a portion of the die pad.

Abstract: A slidable pull-out tray for displaying merchandise in a very neat and attractive manner while making it very easy for the customers to remove a package from the display and very easy for the store proprietor to restock the merchandise. In one embodiment, the trays are self supported by cantilever brackets attached to a gondola bracket fixture. No shelves are required, thereby maximizing the total amount of goods that can be stocked within a given vertical height. In one embodiment, the floor of each tray is an open grid thereby greatly facilitating cleaning of the fixtures. Pusher paddle assemblies engage the open grid and slide along bars forming the grid.

Abstract: Methods and apparatus for maintaining lubrication of rolling cone cutters mounted on journal pins. Embodiments comprise a rotating cone disposed on a journal pin and forming a journal gap there between. A cylindrical journal sleeve is disposed in the journal gap. The journal sleeve has a longitudinal gap forming opposing end portions, which are continuously contoured. A lubrication port is disposed in the journal pin and in fluid communication with a lubrication supply. The lubrication port has an outlet located in a recess in the journal gap. Each end of the recess comprises a transitioning surface extending between the bottom of the recess and the outer surface of the journal pin to prevent sharp transitions. In certain embodiments, the journal pin may comprise two or more lubrication ports, each located in a recess with transitioning surfaces.

Abstract: A method for integrating the IT components which support a business process into a single end-to-end management platform is provided. The method comprises decomposing a business process into a set of enabling applications and then documenting the technology elements and support organizations which are necessary to execute those enabling applications. The required monitors for the business process enabling technology can be deployed which will allow the mapping of technology problems to business problem and the development of correlation rules. This information is then used to develop an end-to-end business process event management (or other system management disciplines such as performance management) platform, which can be integrated into any preexisting event management process. In one embodiment of the present invention, the event management platform can be constructed between several business entities.

Abstract: The present invention provides a method, apparatus, and computer program product for implementing a business systems management solution for end-to-end event management. The present invention realizes a number of business systems management functionalities, including defining event databases and means for event monitoring and correlating a customer's business functions by using an enterprise view focused on a system of applications, operating systems, connections, and physical components. Together these components make up a business system as defined by the customer. As such, a business system can cross technology platforms, physical space, and comprise multiple applications, or a business system could be limited to a single platform, location, and application.

Abstract: A drill bit for use in a borehole at least partially containing drilling fluid includes a bit body having at least two bit components, including at least one leg, the leg having a journal segment, and a roller cone rotatably mounted upon the journal segment and forming at least one bearing cavity therebetween. Also included is an annular primary seal disposed between the leg and the roller cone, an annular secondary seal disposed between the leg and the roller cone and between the annular primary seal and the borehole and an annular space disposed between the annular primary seal and the annular secondary seal, the annular space at least partially containing fluid and being in substantially absolute fluid isolation from the bearing cavity and a conduit for permitting the flow of fluid from the annular space to the borehole. The annular secondary seal may be primarily elastomeric and the means for permitting the flow of fluid may further permit the flow of fluid from the borehole to the annular space.