Patents by Inventor Chris Erwin Orr

Chris Erwin Orr has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8134842
    Abstract: A method for converting a computer rear transition input/output (I/O) to front panel I/O is described. The method includes providing a main board having a first main connector having a first set of pins, and affixing a second main connector having a second set of pins to the main board, where a direction of lengths of the first set of pins is other than parallel to a direction of lengths of the second set of pins.
    Type: Grant
    Filed: December 29, 2006
    Date of Patent: March 13, 2012
    Assignee: GE Intellgent Platforms Embedded Systems, Inc.
    Inventor: Chris Erwin Orr
  • Patent number: 7679916
    Abstract: A system for extracting heat from an electronic device is provided. The system includes heat dissipation means positioned within a printed circuit board to form an in-board heat sink structure and a fluid heat transfer medium disposed in the heat dissipation means. The medium circulates through the heat dissipation means carrying heat away from the electronic device.
    Type: Grant
    Filed: December 8, 2006
    Date of Patent: March 16, 2010
    Assignee: GE Intelligent Platforms Embedded Systems, Inc.
    Inventors: Chris Erwin Orr, David S. Slaton
  • Publication number: 20080160790
    Abstract: A method for converting a computer rear transition input/output (I/O) to front panel I/O is described. The method includes providing a main board having a first main connector having a first set of pins, and affixing a second main connector having a second set of pins to the main board, where a direction of lengths of the first set of pins is other than parallel to a direction of lengths of the second set of pins.
    Type: Application
    Filed: December 29, 2006
    Publication date: July 3, 2008
    Inventor: Chris Erwin ORR
  • Publication number: 20080137307
    Abstract: A system for extracting heat from an electronic device is provided. The system includes heat dissipation means positioned within a printed circuit board to form an in-board heat sink structure and a fluid heat transfer medium disposed in the heat dissipation means. The medium circulates through the heat dissipation means carrying heat away from the electronic device.
    Type: Application
    Filed: December 8, 2006
    Publication date: June 12, 2008
    Inventors: Chris Erwin Orr, David S. Slaton