Abstract: A housing of a wafer processing system includes at least one chamber exhaust outlet and at least one chemical exhaust outlet. The chamber exhaust outlet is formed in the housing for venting gas from the interior of the housing and the chemical exhaust outlet is formed in the housing for venting gas that flows along at least one of: (a) a first flow path defined between the splash shield in a raised position and the collection trays in the lowered position; and (b) a second flow path in which the gas flows through the collection chamber to the chemical exhaust outlet.

Abstract: The wafer processing system includes a rotatable wafer support member for supporting a wafer and a plurality of collections trays disposed about a peripheral edge of the wafer support member. The collection trays are arranged in a stacked configuration, each collection tray having an inner wall portion and an outer wall portion that converge to define a trough section for collecting fluid. The system includes a chamber exhaust outlet that is formed in the housing for venting gas from the interior of the housing outside of the collection trays and a chemical exhaust outlet that is formed in the housing for venting gas that flows through the collection chamber to the chemical exhaust outlet. The chemical exhaust outlet is fluidly isolated from the chamber exhaust outlet.

Abstract: A housing of a wafer processing system includes at least one chamber exhaust outlet and at least one chemical exhaust outlet. The chamber exhaust outlet is formed in the housing for venting gas from the interior of the housing and the chemical exhaust outlet is formed in the housing for venting gas that flows along at least one of: (a) a first flow path defined between the splash shield in a raised position and the collection trays in the lowered position; and (b) a second flow path in which the gas flows through the collection chamber to the chemical exhaust outlet.

Abstract: A reconfigurable wafer spin chuck for supporting a wafer includes a rotatable chuck base having a first opening formed therein and including one or more support members extending upwardly therefrom. The spin chuck is reconfigurable between a first chuck type and a second chuck type, wherein the first chuck type comprises a non-contact wafer type chuck and the second chuck type comprises an open backside frame type chuck. In the non-contact wafer type chuck, a first insert is mounted to the chuck base and supported by the one or more support members and in the open backside frame type chuck, a second insert is mounted to the chuck base and supported by the one or more support members. The wafer is spaced a first distance from the first insert and is spaced a second distance from the second insert, the second distance being greater than the first distance.

Abstract: The wafer processing system includes a rotatable wafer support member for supporting a wafer and a plurality of collections trays disposed about a peripheral edge of the wafer support member. The collection trays are arranged in a stacked configuration, each collection tray having an inner wall portion and an outer wall portion that converge to define a trough section for collecting fluid. The system includes a chamber exhaust outlet that is formed in the housing for venting gas from the interior of the housing outside of the collection trays and a chemical exhaust outlet that is formed in the housing for venting gas that flows through the collection chamber to the chemical exhaust outlet. The chemical exhaust outlet is fluidly isolated from the chamber exhaust outlet.

Abstract: A sensing system is disclosed. The sensing system includes a capacitive sensing pad comprising a first conductive layer and a second conductive layer. A clip is engageable with the pad and comprises a first conductor and a second conductor. The first conductor is configured to conductively engage the first conductive layer and the second conductor is configured to conductively engage the second conductive layer when the clip is engaged with the pad.