Abstract: This patent disclosure describes heat management and removal assemblies for electronic devices that generate heat during use. The disclosed assemblies are particularly useful for cooling insulated gate bipolar transistors (IGBTs). The disclosed assemblies provide a low-resistance parallel cooling circuit for efficiently delivering coolant to one or more electronic devices. The disclosed parallel cooling circuits and assembly designs reduce the pump power required to deliver coolant to one or more electronic devices.

Abstract: A cooling device for an electric component may include a manifold with a coolant section having a coolant inlet trough and a coolant outlet trough. The device may further include a fluid turbulator having a turbulator plate with turbulator fins extending upwardly therefrom, and turbulator inlet openings and outlet openings through the turbulator plate, and a turbulator carrier surrounding the turbulator plate. The fluid turbulator may be installed between the coolant section and the electric component so that a heat exchange reservoir is defined by bottom surface of the electric component, the turbulator plate top surface and the turbulator carrier. Coolant from a coolant source may flow into the coolant inlet trough, through the turbulator inlet opening into the heat exchange reservoir, and out of the heat exchange reservoir through the turbulator outlet opening into the coolant outlet trough to remove heat from the electric component.

Abstract: A cooling device configured to be connected to an object having a surface is disclosed. The cooling device may include a manifold configured to be deposited directly onto the surface of the object, wherein the manifold includes a first side configured to be deposited directly onto the surface of the object, a cavity formed in the first side, an inlet channel fluidly connected to the cavity, and an outlet channel fluidly connected to the cavity. The cooling device may further include a turbulator configured to be deposited directly onto the surface of the object, wherein the turbulator extends into the cavity of the manifold.

Abstract: A cooling device configured to be connected to an object having a surface is disclosed. The cooling device may include a manifold configured to be deposited directly onto the surface of the object, wherein the manifold includes a first side configured to be deposited directly onto the surface of the object, a cavity formed in the first side, an inlet channel fluidly connected to the cavity, and an outlet channel fluidly connected to the cavity. The cooling device may further include a turbulator configured to be deposited directly onto the surface of the object, wherein the turbulator extends into the cavity of the manifold.

Abstract: This patent disclosure describes heat management and removal assemblies for electronic devices that generate heat during use. The disclosed assemblies are particularly useful for cooling insulated gate bipolar transistors (IGBTs). The disclosed assemblies provide a low-resistance parallel cooling circuit for efficiently delivering coolant to one or more electronic devices. The disclosed parallel cooling circuits and assembly designs reduce the pump power required to deliver coolant to one or more electronic devices.

Abstract: A cooling module for an electrical component is provided. The cooling module includes a housing defining an interior space for receiving a coolant. A flow directing member is arranged in the interior space of the housing. The flow directing member includes a plate that is divided into a plurality of discrete cells arranged parallel to each other with adjacent cells being separated from each other by a dividing wall. Each cell has an inlet opening in the plate through which coolant is directed onto a surface of the plate and an outlet opening in the plate through which coolant is directed off the surface of the plate. Each cell has a plurality of fins arranged on the surface of the plate in a herringbone pattern.

Abstract: An exhaust ejector tube is disclosed for use with an engine system. The exhaust ejector tube may have an exhaust pipe with an upstream end, a downstream end, and a plurality of flutes formed at the downstream end. Each of the plurality of flutes may have a rounded end that tapers toward the downstream end. The downstream end of the exhaust pipe terminates partway along a length of the plurality of flutes. The exhaust ejector tube may also have an ejector pipe with a smaller diameter than the exhaust pipe that intersects with the exhaust pipe. The second ejector pipe may have an upstream end located outside the exhaust pipe, and a downstream end located inside the exhaust pipe at the plurality of flutes.

Abstract: A gas flow system for a machine. The gas flow system can include an air filtration system which can include a debris chamber. The gas flow system can also include a first conduit, a second conduit, and one or more tabs. The first conduit can extend from an upstream end to a downstream end. The upstream end of the first conduit can be connected in fluid communication with the debris chamber, and the downstream end of the first conduit can be positioned within the second conduit. The one or more tabs can be positioned within the second conduit adjacent to the downstream end of the first conduit. The second conduit can include one or more of a decreasing diameter and a substantially consistent diameter adjacent to and downstream of the downstream end of the first conduit.

Abstract: A coolant flow control system includes a fluid cooling device, a coolant bypass circuit, and a controller. The controller is configured to generate a control signal indicative of a desired flow of coolant through the coolant bypass circuit as a function of the projected rate of change in the cooling device temperature gradient.

Abstract: A coolant flow control system includes a fluid cooling device, a coolant bypass circuit, and a controller. The controller is configured to generate a control signal indicative of a desired flow of coolant through the coolant bypass circuit as a function of the projected rate of change in the cooling device temperature gradient.

Abstract: An apparatus for measuring elastomeric properties of a specimen during a test procedure includes a first compression member. The apparatus also includes a second compression member. Moreover, the apparatus includes a load cell having a body and a movable probe. The body is fixed in relation to the first compression member. The apparatus also includes a load transferring member positioned in contact with the probe. The specimen is interposed between the load transferring member and the second compression member. The apparatus also includes a bolt which contacts both the first compression member and the second compression member so as to maintain a constant distance therebetween during the test procedure. A method for measuring elastomeric properties of a specimen during a test procedure is also disclosed.