Patents by Inventor Chris Janak

Chris Janak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Modular thermal solution for high-performance processors
    Patent number: 10299403
    Abstract: Various modular thermal management systems for a computing device and methods of using the same are disclosed. In one aspect, a method of providing thermal management for a heat generating component is provided. The method includes placing a heat sink in thermal contact with the heat generating component and coupling a shroud to the heat sink. The shroud has a first opening to direct air in a first direction past the heat sink and a second opening to direct air in a second direction past the heat sink. Air is moved through the first opening or the second opening.
    Type: Grant
    Filed: September 23, 2015
    Date of Patent: May 21, 2019
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Chris Janak, Christopher Jaggers, Ali Akbar Merrikh
  • Dual-use thermal management device
    Patent number: 10236232
    Abstract: Various thermal management devices for providing thermal management of integrated circuit chips are disclosed. In one aspect, a thermal management device is provided that has a heat spreader plate that includes mechanical connection structures to enable the heat spreader plate to mount on a first circuit board and thermally contact the integrated circuit chip when the integrated circuit chip is directly mounted on the first circuit board and to enable the heat spreader plate to mount on a second circuit board having a socket and thermally contact the integrated circuit chip when the integrated circuit chip is mounted in the socket.
    Type: Grant
    Filed: January 19, 2017
    Date of Patent: March 19, 2019
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Chris Janak, Sukesh Shenoy
  • DUAL-USE THERMAL MANAGEMENT DEVICE
    Publication number: 20180206326
    Abstract: Various thermal management devices for providing thermal management of integrated circuit chips are disclosed. In one aspect, a thermal management device is provided that has a heat spreader plate that includes mechanical connection structures to enable the heat spreader plate to mount on a first circuit board and thermally contact the integrated circuit chip when the integrated circuit chip is directly mounted on the first circuit board and to enable the heat spreader plate to mount on a second circuit board having a socket and thermally contact the integrated circuit chip when the integrated circuit chip is mounted in the socket.
    Type: Application
    Filed: January 19, 2017
    Publication date: July 19, 2018
    Inventors: Chris Janak, Sukesh Shenoy
  • MODULAR THERMAL SOLUTION FOR HIGH-PERFORMANCE PROCESSORS
    Publication number: 20170083058
    Abstract: Various modular thermal management systems for a computing device and methods of using the same are disclosed. In one aspect, a method of providing thermal management for a heat generating component is provided. The method includes placing a heat sink in thermal contact with the heat generating component and coupling a shroud to the heat sink. The shroud has a first opening to direct air in a first direction past the heat sink and a second opening to direct air in a second direction past the heat sink. Air is moved through the first opening or the second opening.
    Type: Application
    Filed: September 23, 2015
    Publication date: March 23, 2017
    Inventors: Chris Janak, Christopher Jaggers, Ali Akbar Merrikh