Abstract: A method and apparatus for protecting a diode assembly of a photovoltaic module from compressive forces, tensile forces, and solder migration by providing at least one localized glass barrier are provided. According to various embodiments, a photovoltaic module including a first encasing layer, a second encasing layer, at least one photovoltaic cell disposed between the first and second encasing layers, at least one shielded diode assembly disposed on the at least one photovoltaic cell and electrically connected to the at least one photovoltaic cell, and a pottant disposed between the at least one photovoltaic cell and the second encasing layer is provided. A localized glass barrier may be used to shield the diode assembly.