Abstract: An example embodiment includes an electromagnetic radiation (EMR) shield. The EMR shield is configured to reduce EMR from escaping a host device. The EMR shield includes a structure, two or more module-grounding tabs, and multiple fingers. The structure is configured to substantially surround two or more adjacent transceiver modules positioned in an opening defined in a bezel. The two or more module-grounding tabs extend from the structure. Each of the module-grounding tabs is configured to contact one of the transceiver modules. The fingers extend from the structure and are configured to contact the bezel at multiple contact areas substantially surrounding the opening.

Abstract: An example embodiment includes an electromagnetic radiation (EMR) shield. The EMR shield is configured to reduce EMR from escaping a host device. The EMR shield includes a structure, two or more module-grounding tabs, and multiple fingers. The structure is configured to substantially surround two or more adjacent transceiver modules positioned in an opening defined in a bezel. The two or more module-grounding tabs extend from the structure. Each of the module-grounding tabs is configured to contact one of the transceiver modules. The fingers extend from the structure and are configured to contact the bezel at multiple contact areas substantially surrounding the opening.

Abstract: An optical device may include an optical bench used align a photonic chip to a receptacle. In one embodiment, a surface of the optical bench defines an alignment plane. When a fiber stub in the receptacle is disposed on the surface, an optical path in the stub is parallel with the alignment plane. By disposing the photonic chip on the same surface, the chip and the stub can be aligned such that optical signals can be transmitted between the stub and an optical component (e.g., light source or waveguide) in the photonic chip. In one embodiment, the optical path in the stub and the optical component may have the same height relative to the optical bench. Moreover, the optical device may include a direct thermal connection between the assembly and the heat sink, and thus, have better thermal coupling relative to using thermal pads.

Abstract: An apparatus for handling a fiber-array to be attached with a silicon-photonics chip. The apparatus includes a bottom-plate having a first trench formed with two first branches connected to two first recessed regions at a first end and one second branch straight to a second end thereof and a second trench sharing the same second branch and having two third branches connected to two second recessed regions with an angle towards two sides outside the two first branches. The bottom-plate includes many female clip structures located at the first end, the second end, and the two sides. The apparatus includes a top-plate having corresponding male clip structures configured to lock with the female clip structures to at least have two shaped cavities at the first end for firmly holding fiber ferrules of the fiber-array substantially without lateral and axial motion while leaving excess lengths of fibers outside the second end.

Abstract: Embodiments disclosed herein generally relate to an optical device for transferring light between a first and second waveguide. The optical device may generally include the first waveguide, a first support member and a base on which the first waveguide and first support member are disposed. The optical device may further include a second support member wherein the first support member is disposed between the second support member and the base. The second support member comprises at least one groove. The second waveguide may be disposed at least partially in the groove such that the second waveguide is between the first and second support members. The optical device may further include at least one lens disposed between the first waveguide and the second waveguide to transfer an optical signal between the first and second waveguides through the lens.

Abstract: An optical device may include an optical bench used align a photonic chip to a receptacle. In one embodiment, a surface of the optical bench defines an alignment plane. When a fiber stub in the receptacle is disposed on the surface, an optical path in the stub is parallel with the alignment plane. By disposing the photonic chip on the same surface, the chip and the stub can be aligned such that optical signals can be transmitted between the stub and an optical component (e.g., light source or waveguide) in the photonic chip. In one embodiment, the optical path in the stub and the optical component may have the same height relative to the optical bench.

Abstract: An apparatus for providing single mode optical signal coupling between an opto-electronic transceiver and a single mode optical fiber array takes the form of a lens array and a ferrule component. The lens array includes a plurality of separate lens element disposed to intercept a like plurality of single mode optical output signal from the opto-electronic transceiver and provide as an output a focused version thereof. The ferrule component includes a plurality of single mode fiber stubs that are passively aligned with the lens array and support the transmission of the focused, single mode optical output signals towards the associated single mode optical fiber array.

Abstract: Embodiments disclosed herein generally relate to an optical device for transferring light between a first and second waveguide. The optical device may generally include the first waveguide, a first support member and a base on which the first waveguide and first support member are disposed. The optical device may further include a second support member wherein the first support member is disposed between the second support member and the base. The second support member comprises at least one groove. The second waveguide may be disposed at least partially in the groove such that the second waveguide is between the first and second support members. The optical device may further include at least one lens disposed between the first waveguide and the second waveguide to transfer an optical signal between the first and second waveguides through the lens.

Abstract: Latching mechanisms for electronic modules. In one example embodiment, a latching mechanism for an electronic module includes a latch, a latch return spring, and a release slide. The latch is configured to rotate between a latched position and an unlatched position. The latch includes a latch arm on a first end of the latch and an engagement pin on a second end of the latch. The latch return spring is configured to bias the latch in the latched position. The release slide includes a slide ramp. The slide ramp is configured to engage the latch arm as the release slide is slid away from the engagement pin, which causes the latch to rotate from the latched position to the unlatched position.

Abstract: An apparatus for providing single mode optical signal coupling between an opto-electronic transceiver and a single mode optical fiber array takes the form of a lens array and a ferrule component. The lens array includes a plurality of separate lens element disposed to intercept a like plurality of single mode optical output signal from the opto-electronic transceiver and provide as an output a focused version thereof. The ferrule component includes a plurality of single mode fiber stubs that are passively aligned with the lens array and support the transmission of the focused, single mode optical output signals towards the associated single mode optical fiber array.

Abstract: A transistor outline package having a feedthrough via and lead configuration that maximizes the amount of usable area on a header of the package is disclosed. In one embodiment, the package includes a header having an interior surface that includes a first and second lead assembly. The first lead assembly includes two vias having a first diameter, with each first via being positioned along a first pin circle imaginarily defined on the interior surface of the header. Each first via also includes first leads received therein. The second lead assembly includes four vias having a second diameter each, with each second via being positioned along a second pin circle that has a diameter greater than that of the first pin circle. Each second via includes second leads received therein. This configuration increases usable area on the header interior surface between the leads, enabling relatively larger submounts to be placed thereon.

Abstract: Latching mechanisms for electronic modules. In one example embodiment, a latching mechanism for an electronic module includes a latch, a latch return spring, and a release slide. The latch is configured to rotate between a latched position and an unlatched position. The latch includes a latch arm on a first end of the latch and an engagement pin on a second end of the latch. The latch return spring is configured to bias the latch in the latched position. The release slide includes a slide ramp. The slide ramp is configured to engage the latch arm as the release slide is slid away from the engagement pin, which causes the latch to rotate from the latched position to the unlatched position.

Abstract: An electrical connector that is integrated within an active cable at one end of the active cable, wherein the active cable is configured to communicate over much of its length using one or more optical fibers. The cable may be an electrical to optical cable, and electrical to electrical cable, or one of many other potential configurations.

Abstract: An optical subassembly (“OSA”) for use in optical communications modules is disclosed. The OSA solves various issues related to the insertion and removal of an optical fiber connector into and from the OSA receptacle, including hard plug, wiggle performance, and shavings production. In one embodiment, an optical communications module is disclosed and includes a housing and an optical subassembly of the present invention partially contained within the housing. The optical subassembly includes various components, including a body composed of a first material, and a plug receptacle formed with the body. The plug receptacle includes an inner surface on which surface features, such as threads, are formed. A hollow cylindrical sleeve composed of a second material is received in the plug receptacle such that the outer sleeve surface engages the surface features of the plug receptacle inner surface and such that an optical fiber connector can be received by the sleeve.

Abstract: An integrated array for optoelectronic components in an optical communications system is disclosed. The integrated array incorporates a plurality of optoelectronic modules, such as optical transceivers, in a compact, integrated geometry for positioning within an optical device, such as an optical switch or router. In one embodiment, the integrated array includes a component structure comprised of a plurality of optical transceiver sub-modules, each having dual optical ports. The component structure is integrated as a single structure to minimize the spacing between each transceiver sub-module. This in turn increases the optical port density of the integrated array. The integrated array is received by a cage that is attached to a host board within the optical device. A latching mechanism is included to selectively secure the integrated array within the cage.

Abstract: A transistor outline package having a feedthrough via and lead configuration that maximizes the amount of usable area on a header of the package is disclosed. In one embodiment, the package includes a header having an interior surface that includes a first and second lead assembly. The first lead assembly includes two vias having a first diameter, with each first via being positioned along a first pin circle imaginarily defined on the interior surface of the header. Each first via also includes first leads received therein. The second lead assembly includes four vias having a second diameter each, with each second via being positioned along a second pin circle that has a diameter greater than that of the first pin circle. Each second via includes second leads received therein. This configuration increases usable area on the header interior surface between the leads, enabling relatively larger submounts to be placed thereon.

Abstract: An array system that enables compact positioning of optoelectronic modules, such as optical transceiver modules, within an optical device is disclosed. The array system increases the optical port density of the modules within the optical device, which can comprise an optical switch, an optical router, or the like. In one embodiment, the array system includes a host board and a plurality of daughter cards that connect with the host board edge-on in a perpendicular orientation. A cage is mounted to each daughter card, and an optical transceiver module is received into each cage to electrically connect with a connector receptacle that is positioned on the daughter card. A connectorized optical fiber can be connected to the optical ports of the transceiver using a release sleeve that enables engagement and disengagement of the optical fiber without difficulty despite the increased port density.

Abstract: An optical subassembly (“OSA”) for use in optical communications modules is disclosed. The OSA solves various issues related to the insertion and removal of an optical fiber connector into and from the OSA receptacle, including hard plug, wiggle performance, and shavings production. In one embodiment, an optical communications module is disclosed and includes a housing and an optical subassembly of the present invention partially contained within the housing. The optical subassembly includes various components, including a body composed of a first material, and a plug receptacle formed with the body. The plug receptacle includes an inner surface on which surface features, such as threads, are formed. A hollow cylindrical sleeve composed of a second material is received in the plug receptacle such that the outer sleeve surface engages the surface features of the plug receptacle inner surface and such that an optical fiber connector can be received by the sleeve.

Abstract: Embodiments of the invention are concerned with optical and electrical transceiver modules and, more specifically, to transceiver modules having an integrated cable detachment mechanism. In one example embodiment, a transceiver module includes a housing, a connector receptacle disposed within the housing, and a transfer mechanism connected to the housing. In this example embodiment, the connector receptacle is configured to receive a cable connector having a hood which partially encloses a detachment clip of the cable connector. Also in this example embodiment, the transfer mechanism is disposed such that when the cable connector is received within the connector receptacle, at least a portion of the transfer mechanism extends between the hood and the detachment clip of the cable connector.