Patents by Inventor Chris M. Boyko

Chris M. Boyko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5925206
    Abstract: A new method of preparing blind vias in printed circuit boards and other substrates allows for the drilling of holes for connection between conductive layers, in insulating layers prior to laminating insulating layers together. Each insulative layer is prepared with patterned conductive wiring and holes are drilled through the layer at points where wiring is to connect to another level of wiring. Two layers are aligned, using mechanical, optical, or other alignment mechanisms, and subsequently laminated together. The holes are plated with conductor after lamination to form an electrical connection. Additional layers can be added by the same method.
    Type: Grant
    Filed: April 21, 1997
    Date of Patent: July 20, 1999
    Assignee: International Business Machines Corporation
    Inventors: Chris M. Boyko, Donald S. Farquhar, David Stone, Richard J. Supa